Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
SamtecNumber of Contacts
160
Product Type
PCB Socket
Number of Rows
2
Sub Type
Terminal Assembly
Pitch
0.5mm
Current
2.7A
Termination Type
Solder
Housing Material
Liquid Crystal Polymer
Mount Type
Surface
Orientation
Straight
Stacking Height
10mm
Connector System
Board-to-Board
Voltage
339V
Series
ASP
Minimum Operating Temperature
-55°C
Row Pitch
6.18mm
Contact Gender
Male
Maximum Operating Temperature
125°C
Contact Material
Bronze
Contact Plating
Gold over Nickel
Standards/Approvals
RoHS
Χώρα Προέλευσης
Costa Rica
Λεπτομέρειες Προϊόντος
Altera® HSMC defines electrical and mechanical properties of a high speed mezzanine card interface. This specification standardizes the way in which mezzanine cards communicate and connect to host boards. By taking advantage of the high-performance I/O features found in todays FPGA devices, manufacturers can build a single mezzanine card that will then interface to multiple host boards. Similarly, they can build a host board that can leverage many different, pre-built, mezzanine cards.
Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
€ 16,52
€ 16,52 Μονάδας (Exc. Vat)Χωρίς Φ.Π.Α
€ 20,48
€ 20,48 Μονάδας Με Φ.Π.Α
1
€ 16,52
€ 16,52 Μονάδας (Exc. Vat)Χωρίς Φ.Π.Α
€ 20,48
€ 20,48 Μονάδας Με Φ.Π.Α
Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
1
| Quantity Ποσότητα | Τιμή μονάδας |
|---|---|
| 1 - 9 | € 16,52 |
| 10 - 49 | € 15,66 |
| 50 - 99 | € 14,88 |
| 100 - 249 | € 14,23 |
| 250+ | € 13,63 |
Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
SamtecNumber of Contacts
160
Product Type
PCB Socket
Number of Rows
2
Sub Type
Terminal Assembly
Pitch
0.5mm
Current
2.7A
Termination Type
Solder
Housing Material
Liquid Crystal Polymer
Mount Type
Surface
Orientation
Straight
Stacking Height
10mm
Connector System
Board-to-Board
Voltage
339V
Series
ASP
Minimum Operating Temperature
-55°C
Row Pitch
6.18mm
Contact Gender
Male
Maximum Operating Temperature
125°C
Contact Material
Bronze
Contact Plating
Gold over Nickel
Standards/Approvals
RoHS
Χώρα Προέλευσης
Costa Rica
Λεπτομέρειες Προϊόντος
Altera® HSMC defines electrical and mechanical properties of a high speed mezzanine card interface. This specification standardizes the way in which mezzanine cards communicate and connect to host boards. By taking advantage of the high-performance I/O features found in todays FPGA devices, manufacturers can build a single mezzanine card that will then interface to multiple host boards. Similarly, they can build a host board that can leverage many different, pre-built, mezzanine cards.