Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
STMicroelectronicsDirection Type
Bi-Directional
Maximum Clamping Voltage
13.7V
Minimum Breakdown Voltage
6.7V
Mounting Type
Surface Mount
Package Type
SMB
Maximum Reverse Stand-off Voltage
6V
Pin Count
2
Peak Pulse Power Dissipation
600W
Maximum Peak Pulse Current
290A
Number of Elements per Chip
1
Minimum Operating Temperature
-55 °C
Dimensions
4.6 x 3.95 x 2.45mm
Maximum Operating Temperature
+150 °C
Height
2.45mm
Test Current
10mA
Length
4.6mm
Width
3.95mm
Maximum Reverse Leakage Current
20µA
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Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
P.O.A.
Μονάδας (Σε ένα πακέτο των 10) (Exc. Vat)Χωρίς Φ.Π.Α
10
P.O.A.
Μονάδας (Σε ένα πακέτο των 10) (Exc. Vat)Χωρίς Φ.Π.Α
Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
10
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
STMicroelectronicsDirection Type
Bi-Directional
Maximum Clamping Voltage
13.7V
Minimum Breakdown Voltage
6.7V
Mounting Type
Surface Mount
Package Type
SMB
Maximum Reverse Stand-off Voltage
6V
Pin Count
2
Peak Pulse Power Dissipation
600W
Maximum Peak Pulse Current
290A
Number of Elements per Chip
1
Minimum Operating Temperature
-55 °C
Dimensions
4.6 x 3.95 x 2.45mm
Maximum Operating Temperature
+150 °C
Height
2.45mm
Test Current
10mA
Length
4.6mm
Width
3.95mm
Maximum Reverse Leakage Current
20µA
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
