110 V dc, 250V ac Auxiliary Release Shunt trip for use with FAZ Series MCB/RCBO

Κωδικός Προϊόντος της RS: 922-6958Κατασκευαστής: EatonΚωδικός Κατασκευαστή: 262414 FAZ-XAM002IMPA: 0
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Τεχνικό φυλλάδιο

Προδιαγραφές

Maximum Switching Power DC

0.90 W

Manufacturer Part No.

1SVR011700R0000 - CAIS E UNI 24V D

Output Voltage Adjustment Range

±22.8 V dc, ±25.2V dc

Compatible Pipe Size

4in

Brand

Eaton

Λεπτομέρειες Προϊόντος

Heat Sink 177AB Series, 300mm Wide x 83mm High

ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.

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Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη

Παρακαλούμε ελέγξτε ξανά αργότερα.

Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη

€ 65,41

Μονάδας (Exc. Vat)Χωρίς Φ.Π.Α

€ 81,11

Μονάδας (Including VAT) Με Φ.Π.Α

110 V dc, 250V ac Auxiliary Release Shunt trip for use with FAZ Series MCB/RCBO
sticker-730

€ 65,41

Μονάδας (Exc. Vat)Χωρίς Φ.Π.Α

€ 81,11

Μονάδας (Including VAT) Με Φ.Π.Α

110 V dc, 250V ac Auxiliary Release Shunt trip for use with FAZ Series MCB/RCBO
Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
sticker-730

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more

Τεχνικό φυλλάδιο

Προδιαγραφές

Maximum Switching Power DC

0.90 W

Manufacturer Part No.

1SVR011700R0000 - CAIS E UNI 24V D

Output Voltage Adjustment Range

±22.8 V dc, ±25.2V dc

Compatible Pipe Size

4in

Brand

Eaton

Λεπτομέρειες Προϊόντος

Heat Sink 177AB Series, 300mm Wide x 83mm High

ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more