Molex Micro-Fit 3.0 Series Right Angle Surface Mount PCB Header, 2 Contact(s), 3.0mm Pitch, 1 Row(s), Shrouded

Κωδικός Προϊόντος της RS: 670-2119Κατασκευαστής: MolexΚωδικός Κατασκευαστή: 43650-0209
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Προβολή όλων σε PCB Headers

Τεχνικό φυλλάδιο

Προδιαγραφές

Brand

Molex

Series

MICRO-FIT 3.0

Pitch

3.0mm

Number Of Contacts

2

Number Of Rows

1

Body Orientation

Right Angle

Shrouded/Unshrouded

Shrouded

Connector System

Wire to Board

Mounting Type

Surface Mount

Termination Method

Solder

Contact Plating

Tin

Contact Material

Brass

Series Number

43650

Current Rating

5.0A

Voltage Rating

250.0 V

Χώρα Προέλευσης

Mexico

Λεπτομέρειες Προϊόντος

Molex Micro-Fit 3.0 3.0mm Single Row PCB Headers with Press Fit Metal Retention Clip, 43650 Series

Micro-Fit 3.0 3mm pitch wire to board PCB thruogh hole and SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, solderable metal press-fit retention clips are incorporated into the connector design. The through hole versions with part numbers endng in xx18 also feature kinked solder legs for additional PCB retention. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.

Molex Micro-Fit 3.0 Series

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Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη

Παρακαλούμε ελέγξτε ξανά αργότερα.

Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη

€ 1,76

Μονάδας (Σε ένα πακέτο των 5) (Exc. Vat)Χωρίς Φ.Π.Α

€ 2,182

Μονάδας (Σε ένα πακέτο των 5) Με Φ.Π.Α

Molex Micro-Fit 3.0 Series Right Angle Surface Mount PCB Header, 2 Contact(s), 3.0mm Pitch, 1 Row(s), Shrouded
Επιλέγξτε συσκευασία

€ 1,76

Μονάδας (Σε ένα πακέτο των 5) (Exc. Vat)Χωρίς Φ.Π.Α

€ 2,182

Μονάδας (Σε ένα πακέτο των 5) Με Φ.Π.Α

Molex Micro-Fit 3.0 Series Right Angle Surface Mount PCB Header, 2 Contact(s), 3.0mm Pitch, 1 Row(s), Shrouded
Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
Επιλέγξτε συσκευασία

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more

Τεχνικό φυλλάδιο

Προδιαγραφές

Brand

Molex

Series

MICRO-FIT 3.0

Pitch

3.0mm

Number Of Contacts

2

Number Of Rows

1

Body Orientation

Right Angle

Shrouded/Unshrouded

Shrouded

Connector System

Wire to Board

Mounting Type

Surface Mount

Termination Method

Solder

Contact Plating

Tin

Contact Material

Brass

Series Number

43650

Current Rating

5.0A

Voltage Rating

250.0 V

Χώρα Προέλευσης

Mexico

Λεπτομέρειες Προϊόντος

Molex Micro-Fit 3.0 3.0mm Single Row PCB Headers with Press Fit Metal Retention Clip, 43650 Series

Micro-Fit 3.0 3mm pitch wire to board PCB thruogh hole and SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, solderable metal press-fit retention clips are incorporated into the connector design. The through hole versions with part numbers endng in xx18 also feature kinked solder legs for additional PCB retention. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.

Molex Micro-Fit 3.0 Series

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more