Molex MicroClasp Series Straight Surface Mount PCB Header, 8 Contact(s), 2.0mm Pitch, 2 Row(s), Shrouded
Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
MolexSeries
MICROCLASP
Pitch
2.0mm
Number Of Contacts
8
Number Of Rows
2
Body Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Mounting Type
Surface Mount
Termination Method
Solder
Contact Plating
Tin
Contact Material
Brass
Current Rating
3.0A
Series Number
55917
Voltage Rating
250.0 V
Λεπτομέρειες Προϊόντος
Double Row Vertical Header
2.0mm Wire to Board - Molex MicroClasp™ Range
MicroClasp™ 2.00mm pitch Wire to Board system provides space savings and easy mating/unmating compared to similar 2.00mm and 2.50mm pitch Wire to Board systems. MicroClasp™ includes a unique inner positive lock that provides latch protection, secure retention and an audible mating click. The terminal design of the MicroClasp™ series offers low insertion and withdrawal forces and is able to carry 3.0 A current in a compact 2.00mm pitch design.
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Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
Παρακαλούμε ελέγξτε ξανά αργότερα.
€ 2.200,00
€ 0,50 Each (In a Tray of 4400) (Exc. Vat)Χωρίς Φ.Π.Α
€ 2.728,00
€ 0,62 Each (In a Tray of 4400) Με Φ.Π.Α
4400
€ 2.200,00
€ 0,50 Each (In a Tray of 4400) (Exc. Vat)Χωρίς Φ.Π.Α
€ 2.728,00
€ 0,62 Each (In a Tray of 4400) Με Φ.Π.Α
4400
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products
Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
MolexSeries
MICROCLASP
Pitch
2.0mm
Number Of Contacts
8
Number Of Rows
2
Body Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Mounting Type
Surface Mount
Termination Method
Solder
Contact Plating
Tin
Contact Material
Brass
Current Rating
3.0A
Series Number
55917
Voltage Rating
250.0 V
Λεπτομέρειες Προϊόντος
Double Row Vertical Header
2.0mm Wire to Board - Molex MicroClasp™ Range
MicroClasp™ 2.00mm pitch Wire to Board system provides space savings and easy mating/unmating compared to similar 2.00mm and 2.50mm pitch Wire to Board systems. MicroClasp™ includes a unique inner positive lock that provides latch protection, secure retention and an audible mating click. The terminal design of the MicroClasp™ series offers low insertion and withdrawal forces and is able to carry 3.0 A current in a compact 2.00mm pitch design.
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products