Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
TE ConnectivityPlug/Socket
Socket
Gender
Female
Mounting Type
Through Hole
Termination Method
Press-In
Contact Material
Phosphor Bronze
Housing Material
PET
Contact Plating
Gold over Palladium Nickel over Nickel
Χώρα Προέλευσης
United States
Λεπτομέρειες Προϊόντος
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.
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Παρακαλούμε ελέγξτε ξανά αργότερα.
€ 8,77
€ 8,77 Μονάδας (Exc. Vat)Χωρίς Φ.Π.Α
€ 10,87
€ 10,87 Μονάδας Με Φ.Π.Α
Standard
1
€ 8,77
€ 8,77 Μονάδας (Exc. Vat)Χωρίς Φ.Π.Α
€ 10,87
€ 10,87 Μονάδας Με Φ.Π.Α
Standard
1
Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
TE ConnectivityPlug/Socket
Socket
Gender
Female
Mounting Type
Through Hole
Termination Method
Press-In
Contact Material
Phosphor Bronze
Housing Material
PET
Contact Plating
Gold over Palladium Nickel over Nickel
Χώρα Προέλευσης
United States
Λεπτομέρειες Προϊόντος
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.