Amphenol RF, jack Through Hole MMCX Connector, 50Ω, Solder Termination, Straight Body
Τεχνικό φυλλάδιο
Προδιαγραφές
Gender
Female
Impedance
50Ω
Body Plating
Gold
Body Orientation
Straight
Contact Material
Beryllium Copper
Funnel Diameter
180mm
Operating Frequency
0 to 6GHz
Contact Plating
Gold
Termination Method
Solder
Model
Whad HE 6000Mounting Type
Through Hole
Λεπτομέρειες Προϊόντος
Advanced Power MOSFET, Fairchild Semiconductor
MOSFET Transistors, ON Semi
ON Semi offers a substantial portfolio of MOSFET devices that includes high-voltage (>250V) and low-voltage (<250V) types. The advanced silicon technology provides smaller die sizes, which it is incorporated into multiple industry-standard and thermally-enhanced packages.
ON Semi MOSFETs provide superior design reliability from reduced voltage spikes and overshoot, to lower junction capacitance and reverse recovery charge, to elimination of additional external components to keep systems up and running longer.
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€ 4,99
Μονάδας (Σε μία Σακούλα των 100) (Exc. Vat)Χωρίς Φ.Π.Α
€ 6,188
Μονάδας (Σε μία Σακούλα των 100) (Including VAT) Με Φ.Π.Α
100
€ 4,99
Μονάδας (Σε μία Σακούλα των 100) (Exc. Vat)Χωρίς Φ.Π.Α
€ 6,188
Μονάδας (Σε μία Σακούλα των 100) (Including VAT) Με Φ.Π.Α
100
Τεχνικό φυλλάδιο
Προδιαγραφές
Gender
Female
Impedance
50Ω
Body Plating
Gold
Body Orientation
Straight
Contact Material
Beryllium Copper
Funnel Diameter
180mm
Operating Frequency
0 to 6GHz
Contact Plating
Gold
Termination Method
Solder
Model
Whad HE 6000Mounting Type
Through Hole
Λεπτομέρειες Προϊόντος
Advanced Power MOSFET, Fairchild Semiconductor
MOSFET Transistors, ON Semi
ON Semi offers a substantial portfolio of MOSFET devices that includes high-voltage (>250V) and low-voltage (<250V) types. The advanced silicon technology provides smaller die sizes, which it is incorporated into multiple industry-standard and thermally-enhanced packages.
ON Semi MOSFETs provide superior design reliability from reduced voltage spikes and overshoot, to lower junction capacitance and reverse recovery charge, to elimination of additional external components to keep systems up and running longer.