BI Technologies, HM76, 30 Wire-wound SMD Inductor 100 μH ±20% Wire-Wound 1.5A Idc
Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
BI TechnologiesInductance
100 μH
Maximum dc Current
1.5A
Package/Case
30
Length
13.46mm
Depth
9.4mm
Height
5.9mm
Dimensions
13.46 x 9.4 x 5.9mm
Tolerance
±20%
Maximum DC Resistance
300mΩ
Series
HM76
Maximum Self Resonant Frequency
3MHz
Inductor Construction
Wire-Wound
Maximum Operating Temperature
+125°C
Minimum Operating Temperature
-40°C
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Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
P.O.A.
Μονάδας (Σε ένα πακέτο των 10) (Exc. Vat)Χωρίς Φ.Π.Α
10
P.O.A.
Μονάδας (Σε ένα πακέτο των 10) (Exc. Vat)Χωρίς Φ.Π.Α
Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
10
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products
Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
BI TechnologiesInductance
100 μH
Maximum dc Current
1.5A
Package/Case
30
Length
13.46mm
Depth
9.4mm
Height
5.9mm
Dimensions
13.46 x 9.4 x 5.9mm
Tolerance
±20%
Maximum DC Resistance
300mΩ
Series
HM76
Maximum Self Resonant Frequency
3MHz
Inductor Construction
Wire-Wound
Maximum Operating Temperature
+125°C
Minimum Operating Temperature
-40°C
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products