Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
JSTProduct Type
PCB Header
Series
PH
Pitch
2mm
Current
2A
Number of Contacts
6
Housing Material
Polyamide
Number of Rows
1
Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire-to-Board
Mount Type
Through Hole
Contact Material
Copper Alloy
Contact Plating
Tin
Minimum Operating Temperature
-25°C
Termination Type
Crimp
Row Pitch
2mm
Contact Gender
Male
Maximum Operating Temperature
85°C
Mating Pin Length
3.3mm
Standards/Approvals
No
Voltage
100V
Χώρα Προέλευσης
Malaysia
Λεπτομέρειες Προϊόντος
This is a Thin, Low-Profile 2.0mm Pitch Connector 8.0mm in Height After Mounting and 4.5mm in Width. It is Designed to Meet The Demand for High-Density Connection of internal Wire to Printed Circuit Broads. It is Compact, Highly Reliable and Low in Cost.
Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
€ 3,70
€ 0,37 Μονάδας (Σε ένα πακέτο των 10) (Exc. Vat)Χωρίς Φ.Π.Α
€ 4,59
€ 0,459 Μονάδας (Σε ένα πακέτο των 10) Με Φ.Π.Α
10
€ 3,70
€ 0,37 Μονάδας (Σε ένα πακέτο των 10) (Exc. Vat)Χωρίς Φ.Π.Α
€ 4,59
€ 0,459 Μονάδας (Σε ένα πακέτο των 10) Με Φ.Π.Α
Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
10
| Quantity Ποσότητα | Τιμή μονάδας | Per Πακέτο |
|---|---|---|
| 10 - 40 | € 0,37 | € 3,70 |
| 50 - 90 | € 0,31 | € 3,10 |
| 100 - 240 | € 0,29 | € 2,90 |
| 250 - 490 | € 0,26 | € 2,60 |
| 500+ | € 0,23 | € 2,30 |
Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
JSTProduct Type
PCB Header
Series
PH
Pitch
2mm
Current
2A
Number of Contacts
6
Housing Material
Polyamide
Number of Rows
1
Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire-to-Board
Mount Type
Through Hole
Contact Material
Copper Alloy
Contact Plating
Tin
Minimum Operating Temperature
-25°C
Termination Type
Crimp
Row Pitch
2mm
Contact Gender
Male
Maximum Operating Temperature
85°C
Mating Pin Length
3.3mm
Standards/Approvals
No
Voltage
100V
Χώρα Προέλευσης
Malaysia
Λεπτομέρειες Προϊόντος
This is a Thin, Low-Profile 2.0mm Pitch Connector 8.0mm in Height After Mounting and 4.5mm in Width. It is Designed to Meet The Demand for High-Density Connection of internal Wire to Printed Circuit Broads. It is Compact, Highly Reliable and Low in Cost.