Laird Self-Adhesive Thermal Interface Sheet, 2mm Thick, 1.2W/m·K, Ceramic Filled Silicone Rubber, 100 x 100mm
Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
LairdDimensions
100 x 100mm
Thickness
2mm
Length
100mm
Width
100mm
Thermal Conductivity
1.2W/m·K
Material
Ceramic Filled Silicone Rubber
Self-Adhesive
Yes
Minimum Operating Temperature
-40°C
Maximum Operating Temperature
+160°C
Hardness
Shore OO 27
Operating Temperature Range
-40 → +160 °C
Χώρα Προέλευσης
Czech Republic
Λεπτομέρειες Προϊόντος
T-flex 300 & 3000
T-flex™ 300 is a silicone gel combined with a ceramic powder to offer a unique combination of compliancy, thermal resistance and price. At pressures of 50 psi, it deflects over 50% the original thickness. This high rate of compliancy allows the material to “totally blanket” the component, enhancing thermal transfer. The material has a very low compression set, enabling the pad to be reused many times. Low thermal resistances can be achieved at low pressures.
Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
Παρακαλούμε ελέγξτε ξανά αργότερα.
€ 9,60
Μονάδας (Exc. Vat)Χωρίς Φ.Π.Α
€ 11,90
Μονάδας (Including VAT) Με Φ.Π.Α
1
€ 9,60
Μονάδας (Exc. Vat)Χωρίς Φ.Π.Α
€ 11,90
Μονάδας (Including VAT) Με Φ.Π.Α
1
Αγοράστε μαζικά
| Quantity Ποσότητα | Τιμή μονάδας |
|---|---|
| 1 - 49 | € 9,60 |
| 50 - 99 | € 8,65 |
| 100 - 249 | € 8,04 |
| 250 - 499 | € 7,79 |
| 500+ | € 7,56 |
Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
LairdDimensions
100 x 100mm
Thickness
2mm
Length
100mm
Width
100mm
Thermal Conductivity
1.2W/m·K
Material
Ceramic Filled Silicone Rubber
Self-Adhesive
Yes
Minimum Operating Temperature
-40°C
Maximum Operating Temperature
+160°C
Hardness
Shore OO 27
Operating Temperature Range
-40 → +160 °C
Χώρα Προέλευσης
Czech Republic
Λεπτομέρειες Προϊόντος
T-flex 300 & 3000
T-flex™ 300 is a silicone gel combined with a ceramic powder to offer a unique combination of compliancy, thermal resistance and price. At pressures of 50 psi, it deflects over 50% the original thickness. This high rate of compliancy allows the material to “totally blanket” the component, enhancing thermal transfer. The material has a very low compression set, enabling the pad to be reused many times. Low thermal resistances can be achieved at low pressures.