Microchip SAM9X60D1G-I/4FB ARM926EJ-S Microcontroller SAM9X60 32 bit Arm Cortex 600 MHz 233-Pin TFBGA

Κωδικός Προϊόντος της RS: 566-016Κατασκευαστής: MicrochipΚωδικός Κατασκευαστή: SAM9X60D1G-I/4FB
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Προβολή όλων σε Microprocessors

Τεχνικό φυλλάδιο

Προδιαγραφές

Product Type

Microcontroller

Series

SAM9X60

Device Core

ARM926EJ-S

Data Bus Width

32bit

Instruction Set Architecture

Arm Cortex

Maximum Clock Frequency

600MHz

Interface Type

USB, SDIO, 10/100 Base-TX, ADC, LCD, CAN, I2S, FLEXCOM, Parallel, MMC, NAND, QSPI

Mount Type

Surface

Package Type

TFBGA

Pin Count

233

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

105°C

Width

11 mm

Height

1.2mm

Length

11mm

Standards/Approvals

NIST Special Publication 800-22, FIPS PUBs 140-2 and 140-3, FIPS PUB 46-3, FIPS PUB 197, FIPS PUB 180-2

Automotive Standard

AEC-Q100 Grade 2

Number of Cores

1

Χώρα Προέλευσης

Taiwan, Province Of China

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Προβολή όλων σε Microprocessors

Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη

€ 13,78

€ 13,78 Μονάδας (Exc. Vat)Χωρίς Φ.Π.Α

€ 17,09

€ 17,09 Μονάδας Με Φ.Π.Α

Microchip SAM9X60D1G-I/4FB ARM926EJ-S Microcontroller SAM9X60 32 bit Arm Cortex 600 MHz 233-Pin TFBGA

€ 13,78

€ 13,78 Μονάδας (Exc. Vat)Χωρίς Φ.Π.Α

€ 17,09

€ 17,09 Μονάδας Με Φ.Π.Α

Microchip SAM9X60D1G-I/4FB ARM926EJ-S Microcontroller SAM9X60 32 bit Arm Cortex 600 MHz 233-Pin TFBGA

Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more

Τεχνικό φυλλάδιο

Προδιαγραφές

Product Type

Microcontroller

Series

SAM9X60

Device Core

ARM926EJ-S

Data Bus Width

32bit

Instruction Set Architecture

Arm Cortex

Maximum Clock Frequency

600MHz

Interface Type

USB, SDIO, 10/100 Base-TX, ADC, LCD, CAN, I2S, FLEXCOM, Parallel, MMC, NAND, QSPI

Mount Type

Surface

Package Type

TFBGA

Pin Count

233

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

105°C

Width

11 mm

Height

1.2mm

Length

11mm

Standards/Approvals

NIST Special Publication 800-22, FIPS PUBs 140-2 and 140-3, FIPS PUB 46-3, FIPS PUB 197, FIPS PUB 180-2

Automotive Standard

AEC-Q100 Grade 2

Number of Cores

1

Χώρα Προέλευσης

Taiwan, Province Of China

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more