Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
MolexProduct Type
PCB Header
Series
iGrid 2.0
Current
2A
Pitch
2mm
Number of Contacts
10
Housing Material
Polyamide
Number of Rows
2
Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
iGrid Wire to Board Dual Row System
Mount Type
Through Hole
Contact Material
Brass
Contact Plating
Gold
Minimum Operating Temperature
-40°C
Row Pitch
2mm
Termination Type
Solder
Contact Gender
Male
Tail Pin Length
3.2mm
Maximum Operating Temperature
105°C
Standards/Approvals
UL E29179
Voltage
250V
Χώρα Προέλευσης
Japan
Λεπτομέρειες Προϊόντος
The Molex iGrid PCB header made up of the brass metal and having the gold plating. The header through hole termination method. The header has maximum current per contact 2A and maximum voltage 250V AC.
Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
€ 278,15
€ 278,15 1 Tray of 140 (Exc. Vat)Χωρίς Φ.Π.Α
€ 344,91
€ 344,91 1 Tray of 140 Με Φ.Π.Α
1
€ 278,15
€ 278,15 1 Tray of 140 (Exc. Vat)Χωρίς Φ.Π.Α
€ 344,91
€ 344,91 1 Tray of 140 Με Φ.Π.Α
Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
1
Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
MolexProduct Type
PCB Header
Series
iGrid 2.0
Current
2A
Pitch
2mm
Number of Contacts
10
Housing Material
Polyamide
Number of Rows
2
Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
iGrid Wire to Board Dual Row System
Mount Type
Through Hole
Contact Material
Brass
Contact Plating
Gold
Minimum Operating Temperature
-40°C
Row Pitch
2mm
Termination Type
Solder
Contact Gender
Male
Tail Pin Length
3.2mm
Maximum Operating Temperature
105°C
Standards/Approvals
UL E29179
Voltage
250V
Χώρα Προέλευσης
Japan
Λεπτομέρειες Προϊόντος
The Molex iGrid PCB header made up of the brass metal and having the gold plating. The header through hole termination method. The header has maximum current per contact 2A and maximum voltage 250V AC.