Molex Micro-Fit 3.0 Series Right Angle Surface Mount PCB Header, 8 Contact(s), 3.0mm Pitch, 2 Row(s), Shrouded
Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
MolexSeries
MICRO-FIT 3.0
Pitch
3.0mm
Number Of Contacts
8
Number Of Rows
2
Body Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Mounting Type
Surface Mount
Termination Method
Solder
Contact Plating
Tin
Contact Material
Brass
Series Number
43045
Current Rating
5.0A
Voltage Rating
250.0 V
Λεπτομέρειες Προϊόντος
Molex Micro-Fit 3.0 3.0mm Dual Row SMT Headers with Solder Tabs, 43045 Series
Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.
Molex Micro-Fit 3.0 Series
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Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
Παρακαλούμε ελέγξτε ξανά αργότερα.
€ 3,83
Μονάδας (διαθέσιμο σε ένα καρούλι) (Exc. Vat)Χωρίς Φ.Π.Α
€ 4,749
Μονάδας (διαθέσιμο σε ένα καρούλι) Με Φ.Π.Α
Συσκευασία Παραγωγής (Καρούλι)
100
€ 3,83
Μονάδας (διαθέσιμο σε ένα καρούλι) (Exc. Vat)Χωρίς Φ.Π.Α
€ 4,749
Μονάδας (διαθέσιμο σε ένα καρούλι) Με Φ.Π.Α
Συσκευασία Παραγωγής (Καρούλι)
100
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products
Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
MolexSeries
MICRO-FIT 3.0
Pitch
3.0mm
Number Of Contacts
8
Number Of Rows
2
Body Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Mounting Type
Surface Mount
Termination Method
Solder
Contact Plating
Tin
Contact Material
Brass
Series Number
43045
Current Rating
5.0A
Voltage Rating
250.0 V
Λεπτομέρειες Προϊόντος
Molex Micro-Fit 3.0 3.0mm Dual Row SMT Headers with Solder Tabs, 43045 Series
Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.
Molex Micro-Fit 3.0 Series
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products