Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
MolexSeries
Micro-Fit 3.0
Product Type
PCB Header
Pitch
3mm
Current
5A
Number of Contacts
12
Housing Material
High Temperature Thermoplastic
Number of Rows
2
Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Wire-to-Board
Mount Type
Surface
Contact Material
Brass
Contact Plating
Gold
Minimum Operating Temperature
-40°C
Row Pitch
3mm
Termination Type
Solder
Contact Gender
Male
Maximum Operating Temperature
125°C
Mating Pin Length
3mm
Standards/Approvals
No
Voltage
250 V
Distrelec Product Id
304-56-284
Χώρα Προέλευσης
Mexico
Λεπτομέρειες Προϊόντος
Molex Micro-Fit 3.0 3.0mm Dual Row SMT Headers with Solder Tabs, 43045 Series
Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.
Molex Micro-Fit 3.0 Series
Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
€ 39,55
€ 7,91 Μονάδας (Σε ένα πακέτο των 5) (Exc. Vat)Χωρίς Φ.Π.Α
€ 49,04
€ 9,808 Μονάδας (Σε ένα πακέτο των 5) Με Φ.Π.Α
Standard
5
€ 39,55
€ 7,91 Μονάδας (Σε ένα πακέτο των 5) (Exc. Vat)Χωρίς Φ.Π.Α
€ 49,04
€ 9,808 Μονάδας (Σε ένα πακέτο των 5) Με Φ.Π.Α
Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
Standard
5
| Quantity Ποσότητα | Τιμή μονάδας | Per Πακέτο |
|---|---|---|
| 5 - 95 | € 7,91 | € 39,55 |
| 100 - 370 | € 6,37 | € 31,85 |
| 375 - 1495 | € 6,21 | € 31,05 |
| 1500 - 2995 | € 6,06 | € 30,30 |
| 3000+ | € 5,90 | € 29,50 |
Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
MolexSeries
Micro-Fit 3.0
Product Type
PCB Header
Pitch
3mm
Current
5A
Number of Contacts
12
Housing Material
High Temperature Thermoplastic
Number of Rows
2
Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Wire-to-Board
Mount Type
Surface
Contact Material
Brass
Contact Plating
Gold
Minimum Operating Temperature
-40°C
Row Pitch
3mm
Termination Type
Solder
Contact Gender
Male
Maximum Operating Temperature
125°C
Mating Pin Length
3mm
Standards/Approvals
No
Voltage
250 V
Distrelec Product Id
304-56-284
Χώρα Προέλευσης
Mexico
Λεπτομέρειες Προϊόντος
Molex Micro-Fit 3.0 3.0mm Dual Row SMT Headers with Solder Tabs, 43045 Series
Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.


