Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
MolexSeries
Micro-Fit 3.0
Product Type
PCB Header
Current
5A
Pitch
3mm
Housing Material
Thermoplastic
Number of Contacts
18
Number of Rows
2
Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire-to-Board
Mount Type
Surface
Contact Material
Brass
Contact Plating
Tin
Row Pitch
3mm
Termination Type
Solder
Minimum Operating Temperature
-40°C
Maximum Operating Temperature
105°C
Contact Gender
Male
Standards/Approvals
No
Mating Pin Length
3mm
Voltage
250 V
Χώρα Προέλευσης
Mexico
Λεπτομέρειες Προϊόντος
Molex Micro-Fit 3.0 3.0mm Dual Row PCB Headers with Metal Press Fit Retention Clips, 43045 Series
Micro-Fit 3.0 3mm pitch wire to board dual row PCB through hole and SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, metal press-fit retention clips are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.
Molex Micro-Fit 3.0 Series
Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
€ 5.510,00
€ 5,51 Μονάδας (Σε ένα καρούλι των 1000) (Exc. Vat)Χωρίς Φ.Π.Α
€ 6.832,40
€ 6,832 Μονάδας (Σε ένα καρούλι των 1000) Με Φ.Π.Α
1000
€ 5.510,00
€ 5,51 Μονάδας (Σε ένα καρούλι των 1000) (Exc. Vat)Χωρίς Φ.Π.Α
€ 6.832,40
€ 6,832 Μονάδας (Σε ένα καρούλι των 1000) Με Φ.Π.Α
Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
1000
Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
MolexSeries
Micro-Fit 3.0
Product Type
PCB Header
Current
5A
Pitch
3mm
Housing Material
Thermoplastic
Number of Contacts
18
Number of Rows
2
Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire-to-Board
Mount Type
Surface
Contact Material
Brass
Contact Plating
Tin
Row Pitch
3mm
Termination Type
Solder
Minimum Operating Temperature
-40°C
Maximum Operating Temperature
105°C
Contact Gender
Male
Standards/Approvals
No
Mating Pin Length
3mm
Voltage
250 V
Χώρα Προέλευσης
Mexico
Λεπτομέρειες Προϊόντος
Molex Micro-Fit 3.0 3.0mm Dual Row PCB Headers with Metal Press Fit Retention Clips, 43045 Series
Micro-Fit 3.0 3mm pitch wire to board dual row PCB through hole and SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, metal press-fit retention clips are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.


