Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
MolexProduct Type
PCB Header
Series
43045
Pitch
3mm
Current
8.5A
Number of Contacts
18
Housing Material
Thermoplastic
Number of Rows
2
Orientation
Vertical
Shrouded/Unshrouded
Shrouded
Mount Type
Through Hole
Connector System
Wire-to-Board
Contact Material
Brass
Contact Plating
Gold
Minimum Operating Temperature
-40°C
Termination Type
Through Hole
Maximum Operating Temperature
105°C
Χώρα Προέλευσης
China
Λεπτομέρειες Προϊόντος
The Molex Micro-Fit 3.0 Vertical Header is expertly engineered for power and wire-to-board applications, delivering high reliability in demanding environments. This component features a Compact design with a 3.00mm pitch and dual-row configuration, accommodating up to 18 circuits. Its robust construction includes high-temperature thermoplastic materials and a gold-plated mating interface, ensuring durability and excellent electrical performance. With compliance to international safety standards, this header offers peace of mind for engineers seeking a dependable solution for their PCB header and receptacle needs, particularly in applications requiring a high-temperature performance. Additional features like full shrouding and a secure PCB retention mechanism make it an Ideal choice for Advanced electronics.
Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
€ 14,62
€ 14,62 1 Πακέτο των 2 (Exc. Vat)Χωρίς Φ.Π.Α
€ 18,13
€ 18,13 1 Πακέτο των 2 Με Φ.Π.Α
1
€ 14,62
€ 14,62 1 Πακέτο των 2 (Exc. Vat)Χωρίς Φ.Π.Α
€ 18,13
€ 18,13 1 Πακέτο των 2 Με Φ.Π.Α
Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
1
| Quantity Ποσότητα | Τιμή μονάδας |
|---|---|
| 1 - 9 | € 14,62 |
| 10 - 24 | € 13,65 |
| 25+ | € 12,53 |
Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
MolexProduct Type
PCB Header
Series
43045
Pitch
3mm
Current
8.5A
Number of Contacts
18
Housing Material
Thermoplastic
Number of Rows
2
Orientation
Vertical
Shrouded/Unshrouded
Shrouded
Mount Type
Through Hole
Connector System
Wire-to-Board
Contact Material
Brass
Contact Plating
Gold
Minimum Operating Temperature
-40°C
Termination Type
Through Hole
Maximum Operating Temperature
105°C
Χώρα Προέλευσης
China
Λεπτομέρειες Προϊόντος
The Molex Micro-Fit 3.0 Vertical Header is expertly engineered for power and wire-to-board applications, delivering high reliability in demanding environments. This component features a Compact design with a 3.00mm pitch and dual-row configuration, accommodating up to 18 circuits. Its robust construction includes high-temperature thermoplastic materials and a gold-plated mating interface, ensuring durability and excellent electrical performance. With compliance to international safety standards, this header offers peace of mind for engineers seeking a dependable solution for their PCB header and receptacle needs, particularly in applications requiring a high-temperature performance. Additional features like full shrouding and a secure PCB retention mechanism make it an Ideal choice for Advanced electronics.