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Molex Micro-Fit 3.0 Series Right Angle Through Hole PCB Header, 2 Contact(s), 3.0mm Pitch, 1 Row(s), Shrouded

Κωδικός Προϊόντος της RS: 670-4698Κατασκευαστής: MolexΚωδικός Κατασκευαστή: 43650-0200
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Προβολή όλων σε PCB Headers

Τεχνικό φυλλάδιο

Προδιαγραφές

Brand

Molex

Series

MICRO-FIT 3.0

Pitch

3.0mm

Number Of Contacts

2

Number Of Rows

1

Body Orientation

Right Angle

Shrouded/Unshrouded

Shrouded

Connector System

Wire to Board

Mounting Type

Through Hole

Termination Method

Solder

Contact Plating

Tin

Contact Material

Brass

Series Number

43650

Current Rating

5.0A

Voltage Rating

250.0 V

Gender

Male

Χώρα Προέλευσης

China

Λεπτομέρειες Προϊόντος

Molex Micro-Fit 3.0 3.0mm Single Row PCB Headers with Snap in Plastic Peg PCB Lock, 43650 Series

Micro-Fit 3.0 3mm pitch wire to board single row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, snap-in plastic peg PCB locks are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs

Molex Micro-Fit 3.0 Series

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Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη

Παρακαλούμε ελέγξτε ξανά αργότερα.

Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη

€ 1,79

Μονάδας (Σε ένα πακέτο των 5) (Exc. Vat)Χωρίς Φ.Π.Α

€ 2,22

Μονάδας (Σε ένα πακέτο των 5) Με Φ.Π.Α

Molex Micro-Fit 3.0 Series Right Angle Through Hole PCB Header, 2 Contact(s), 3.0mm Pitch, 1 Row(s), Shrouded
Επιλέγξτε συσκευασία

€ 1,79

Μονάδας (Σε ένα πακέτο των 5) (Exc. Vat)Χωρίς Φ.Π.Α

€ 2,22

Μονάδας (Σε ένα πακέτο των 5) Με Φ.Π.Α

Molex Micro-Fit 3.0 Series Right Angle Through Hole PCB Header, 2 Contact(s), 3.0mm Pitch, 1 Row(s), Shrouded
Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
Επιλέγξτε συσκευασία

Αγοράστε μαζικά

Quantity ΠοσότηταΤιμή μονάδαςPer Πακέτο
5 - 95€ 1,79€ 8,95
100 - 370€ 1,26€ 6,30
375 - 1495€ 1,21€ 6,05
1500 - 2995€ 1,13€ 5,65
3000+€ 1,11€ 5,55

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more

Τεχνικό φυλλάδιο

Προδιαγραφές

Brand

Molex

Series

MICRO-FIT 3.0

Pitch

3.0mm

Number Of Contacts

2

Number Of Rows

1

Body Orientation

Right Angle

Shrouded/Unshrouded

Shrouded

Connector System

Wire to Board

Mounting Type

Through Hole

Termination Method

Solder

Contact Plating

Tin

Contact Material

Brass

Series Number

43650

Current Rating

5.0A

Voltage Rating

250.0 V

Gender

Male

Χώρα Προέλευσης

China

Λεπτομέρειες Προϊόντος

Molex Micro-Fit 3.0 3.0mm Single Row PCB Headers with Snap in Plastic Peg PCB Lock, 43650 Series

Micro-Fit 3.0 3mm pitch wire to board single row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, snap-in plastic peg PCB locks are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs

Molex Micro-Fit 3.0 Series

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more