Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
MolexSeries
Micro-Fit 3.0
Product Type
PCB Header
Pitch
3mm
Current
5A
Number of Contacts
2
Housing Material
Thermoplastic
Number of Rows
1
Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire-to-Board
Mount Type
Through Hole
Contact Material
Brass
Contact Plating
Tin
Minimum Operating Temperature
-40°C
Row Pitch
3mm
Termination Type
Solder
Contact Gender
Male
Maximum Operating Temperature
105°C
Standards/Approvals
No
Voltage
250 V
Distrelec Product Id
304-42-700
Λεπτομέρειες Προϊόντος
Molex Micro-Fit 3.0 3.0mm Single Row PCB Headers with Snap in Plastic Peg PCB Lock, 43650 Series
Micro-Fit 3.0 3mm pitch wire to board single row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, snap-in plastic peg PCB locks are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs
Molex Micro-Fit 3.0 Series
Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
€ 136,00
€ 1,36 Μονάδας (διαθέσιμο σε μία σακούλα) (Exc. Vat)Χωρίς Φ.Π.Α
€ 168,64
€ 1,686 Μονάδας (διαθέσιμο σε μία σακούλα) Με Φ.Π.Α
Συσκευασία Παραγωγής (Σακούλα)
100
€ 136,00
€ 1,36 Μονάδας (διαθέσιμο σε μία σακούλα) (Exc. Vat)Χωρίς Φ.Π.Α
€ 168,64
€ 1,686 Μονάδας (διαθέσιμο σε μία σακούλα) Με Φ.Π.Α
Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
Συσκευασία Παραγωγής (Σακούλα)
100
| Quantity Ποσότητα | Τιμή μονάδας | Per Σακούλα |
|---|---|---|
| 100 - 370 | € 1,36 | € 6,80 |
| 375 - 1495 | € 1,31 | € 6,55 |
| 1500 - 2995 | € 1,23 | € 6,15 |
| 3000+ | € 1,20 | € 6,00 |
Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
MolexSeries
Micro-Fit 3.0
Product Type
PCB Header
Pitch
3mm
Current
5A
Number of Contacts
2
Housing Material
Thermoplastic
Number of Rows
1
Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire-to-Board
Mount Type
Through Hole
Contact Material
Brass
Contact Plating
Tin
Minimum Operating Temperature
-40°C
Row Pitch
3mm
Termination Type
Solder
Contact Gender
Male
Maximum Operating Temperature
105°C
Standards/Approvals
No
Voltage
250 V
Distrelec Product Id
304-42-700
Λεπτομέρειες Προϊόντος
Molex Micro-Fit 3.0 3.0mm Single Row PCB Headers with Snap in Plastic Peg PCB Lock, 43650 Series
Micro-Fit 3.0 3mm pitch wire to board single row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, snap-in plastic peg PCB locks are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs


