Molex Micro-Fit 3.0 Series Right Angle Surface PCB Header, 3 Contact(s), 3 mm Pitch, 1 Row(s), Shrouded

Κωδικός Προϊόντος της RS: 447-6827Κατασκευαστής: MolexΚωδικός Κατασκευαστή: 43650-0312
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Προβολή όλων σε PCB Headers

Τεχνικό φυλλάδιο

Προδιαγραφές

Brand

Molex

Series

Micro-Fit 3.0

Product Type

PCB Header

Current

5A

Pitch

3mm

Housing Material

High Temperature Thermoplastic

Number of Contacts

3

Number of Rows

1

Orientation

Right Angle

Shrouded/Unshrouded

Shrouded

Connector System

Wire-to-Board

Mount Type

Surface

Contact Material

Brass

Contact Plating

Tin

Row Pitch

3mm

Termination Type

Solder

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

105°C

Contact Gender

Male

Standards/Approvals

No

Voltage

250 V

Χώρα Προέλευσης

Mexico

Λεπτομέρειες Προϊόντος

Molex Micro-Fit 3.0 3.0mm Single Row SMT Headers with Solder Tab, 43650 Series

Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.

Molex Micro-Fit 3.0 Series

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Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη

€ 15,15

€ 3,03 Μονάδας (Σε ένα πακέτο των 5) (Exc. Vat)Χωρίς Φ.Π.Α

€ 18,79

€ 3,757 Μονάδας (Σε ένα πακέτο των 5) Με Φ.Π.Α

Molex Micro-Fit 3.0 Series Right Angle Surface PCB Header, 3 Contact(s), 3 mm Pitch, 1 Row(s), Shrouded
Επιλέγξτε συσκευασία

€ 15,15

€ 3,03 Μονάδας (Σε ένα πακέτο των 5) (Exc. Vat)Χωρίς Φ.Π.Α

€ 18,79

€ 3,757 Μονάδας (Σε ένα πακέτο των 5) Με Φ.Π.Α

Molex Micro-Fit 3.0 Series Right Angle Surface PCB Header, 3 Contact(s), 3 mm Pitch, 1 Row(s), Shrouded

Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη

Επιλέγξτε συσκευασία

Quantity ΠοσότηταΤιμή μονάδαςPer Πακέτο
5 - 95€ 3,03€ 15,15
100 - 370€ 2,17€ 10,85
375 - 1495€ 2,11€ 10,55
1500 - 2995€ 2,06€ 10,30
3000+€ 2,01€ 10,05

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more

Τεχνικό φυλλάδιο

Προδιαγραφές

Brand

Molex

Series

Micro-Fit 3.0

Product Type

PCB Header

Current

5A

Pitch

3mm

Housing Material

High Temperature Thermoplastic

Number of Contacts

3

Number of Rows

1

Orientation

Right Angle

Shrouded/Unshrouded

Shrouded

Connector System

Wire-to-Board

Mount Type

Surface

Contact Material

Brass

Contact Plating

Tin

Row Pitch

3mm

Termination Type

Solder

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

105°C

Contact Gender

Male

Standards/Approvals

No

Voltage

250 V

Χώρα Προέλευσης

Mexico

Λεπτομέρειες Προϊόντος

Molex Micro-Fit 3.0 3.0mm Single Row SMT Headers with Solder Tab, 43650 Series

Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.

Molex Micro-Fit 3.0 Series

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more