Molex Micro-Fit 3.0 Series Right Angle Surface PCB Header, 3 Contact(s), 3 mm Pitch, 1 Row(s), Shrouded
Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
MolexSeries
Micro-Fit 3.0
Product Type
PCB Header
Pitch
3mm
Current
5A
Number of Contacts
3
Housing Material
High Temperature Thermoplastic
Number of Rows
1
Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire-to-Board
Mount Type
Surface
Contact Material
Brass
Contact Plating
Gold
Minimum Operating Temperature
-40°C
Row Pitch
3mm
Termination Type
Solder
Contact Gender
Male
Maximum Operating Temperature
125°C
Standards/Approvals
No
Voltage
250 V
Distrelec Product Id
304-62-230
Λεπτομέρειες Προϊόντος
Molex Micro-Fit 3.0 3.0mm Single Row SMT Headers with Solder Tab, 43650 Series
Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.
Molex Micro-Fit 3.0 Series
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€ 282,00
€ 2,82 Μονάδας (διαθέσιμο σε ένα καρούλι) (Exc. Vat)Χωρίς Φ.Π.Α
€ 349,68
€ 3,497 Μονάδας (διαθέσιμο σε ένα καρούλι) Με Φ.Π.Α
Συσκευασία Παραγωγής (Καρούλι)
100
€ 282,00
€ 2,82 Μονάδας (διαθέσιμο σε ένα καρούλι) (Exc. Vat)Χωρίς Φ.Π.Α
€ 349,68
€ 3,497 Μονάδας (διαθέσιμο σε ένα καρούλι) Με Φ.Π.Α
Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
Συσκευασία Παραγωγής (Καρούλι)
100
Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
| Quantity Ποσότητα | Τιμή μονάδας | Per Καρούλι |
|---|---|---|
| 100 - 370 | € 2,82 | € 14,10 |
| 375 - 1495 | € 2,64 | € 13,20 |
| 1500 - 2995 | € 2,32 | € 11,60 |
| 3000+ | € 2,27 | € 11,35 |
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products
Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
MolexSeries
Micro-Fit 3.0
Product Type
PCB Header
Pitch
3mm
Current
5A
Number of Contacts
3
Housing Material
High Temperature Thermoplastic
Number of Rows
1
Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire-to-Board
Mount Type
Surface
Contact Material
Brass
Contact Plating
Gold
Minimum Operating Temperature
-40°C
Row Pitch
3mm
Termination Type
Solder
Contact Gender
Male
Maximum Operating Temperature
125°C
Standards/Approvals
No
Voltage
250 V
Distrelec Product Id
304-62-230
Λεπτομέρειες Προϊόντος
Molex Micro-Fit 3.0 3.0mm Single Row SMT Headers with Solder Tab, 43650 Series
Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.
Molex Micro-Fit 3.0 Series
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products