Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
MolexSeries
MICROCLASP
Pitch
2.0mm
Number Of Contacts
18
Number Of Rows
2
Body Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Mounting Type
Surface Mount
Termination Method
Solder
Contact Plating
Tin
Contact Material
Brass
Series Number
55917
Current Rating
3.0A
Voltage Rating
250.0 V
Λεπτομέρειες Προϊόντος
Double Row Vertical Header
2.0mm Wire to Board - Molex MicroClasp™ Range
MicroClasp™ 2.00mm pitch Wire to Board system provides space savings and easy mating/unmating compared to similar 2.00mm and 2.50mm pitch Wire to Board systems. MicroClasp™ includes a unique inner positive lock that provides latch protection, secure retention and an audible mating click. The terminal design of the MicroClasp™ series offers low insertion and withdrawal forces and is able to carry 3.0 A current in a compact 2.00mm pitch design.
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Παρακαλούμε ελέγξτε ξανά αργότερα.
P.O.A.
Standard
10
P.O.A.
Standard
10
Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
MolexSeries
MICROCLASP
Pitch
2.0mm
Number Of Contacts
18
Number Of Rows
2
Body Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Mounting Type
Surface Mount
Termination Method
Solder
Contact Plating
Tin
Contact Material
Brass
Series Number
55917
Current Rating
3.0A
Voltage Rating
250.0 V
Λεπτομέρειες Προϊόντος
Double Row Vertical Header
2.0mm Wire to Board - Molex MicroClasp™ Range
MicroClasp™ 2.00mm pitch Wire to Board system provides space savings and easy mating/unmating compared to similar 2.00mm and 2.50mm pitch Wire to Board systems. MicroClasp™ includes a unique inner positive lock that provides latch protection, secure retention and an audible mating click. The terminal design of the MicroClasp™ series offers low insertion and withdrawal forces and is able to carry 3.0 A current in a compact 2.00mm pitch design.