Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
MurataInductance
3 nH
Maximum dc Current
300mA
Package/Case
0402 (1005M)
Length
1mm
Depth
0.5mm
Height
0.5mm
Dimensions
1 x 0.5 x 0.5mm
Tolerance
±0.3nH
Maximum DC Resistance
180mΩ
Series
LQG15HN
Inductor Construction
Multilayer
Maximum Operating Temperature
+125°C
Moulded
Yes
Minimum Operating Temperature
-55°C
Minimum Quality Factor
8
Χώρα Προέλευσης
Japan
Λεπτομέρειες Προϊόντος
Murata 0402 LQG15HN Series High Frequency Chip Inductors
LQG15HN SMD inductors from Murata feature a multilayer construction. Despite a lower Q factor than wire wound equivalents, the multilayer construction provides excellent balance between rated current, size and L value tolerance among others.
LQGH15HS SMD inductors are highly reliable and suitable for application in chokes, WLAN networks, RF circuit matching and mobile communication equipment resonance.
€ 10,00
€ 0,05 Μονάδας (Σε ένα πακέτο των 200) (Exc. Vat)Χωρίς Φ.Π.Α
€ 12,40
€ 0,062 Μονάδας (Σε ένα πακέτο των 200) Με Φ.Π.Α
Standard
200
€ 10,00
€ 0,05 Μονάδας (Σε ένα πακέτο των 200) (Exc. Vat)Χωρίς Φ.Π.Α
€ 12,40
€ 0,062 Μονάδας (Σε ένα πακέτο των 200) Με Φ.Π.Α
Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
Standard
200
Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
MurataInductance
3 nH
Maximum dc Current
300mA
Package/Case
0402 (1005M)
Length
1mm
Depth
0.5mm
Height
0.5mm
Dimensions
1 x 0.5 x 0.5mm
Tolerance
±0.3nH
Maximum DC Resistance
180mΩ
Series
LQG15HN
Inductor Construction
Multilayer
Maximum Operating Temperature
+125°C
Moulded
Yes
Minimum Operating Temperature
-55°C
Minimum Quality Factor
8
Χώρα Προέλευσης
Japan
Λεπτομέρειες Προϊόντος
Murata 0402 LQG15HN Series High Frequency Chip Inductors
LQG15HN SMD inductors from Murata feature a multilayer construction. Despite a lower Q factor than wire wound equivalents, the multilayer construction provides excellent balance between rated current, size and L value tolerance among others.
LQGH15HS SMD inductors are highly reliable and suitable for application in chokes, WLAN networks, RF circuit matching and mobile communication equipment resonance.


