Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
MurataInductance
6.8 nH
Maximum dc Current
300mA
Package/Case
0402 (1005M)
Length
1mm
Depth
0.5mm
Height
0.5mm
Dimensions
1 x 0.5 x 0.5mm
Tolerance
±5%
Maximum DC Resistance
290mΩ
Series
LQG15HN
Inductor Construction
Multilayer
Maximum Operating Temperature
+125°C
Moulded
Yes
Minimum Operating Temperature
-55°C
Minimum Quality Factor
8
Χώρα Προέλευσης
Japan
Λεπτομέρειες Προϊόντος
Murata 0402 LQG15HN Series High Frequency Chip Inductors
LQG15HN SMD inductors from Murata feature a multilayer construction. Despite a lower Q factor than wire wound equivalents, the multilayer construction provides excellent balance between rated current, size and L value tolerance among others.
LQGH15HS SMD inductors are highly reliable and suitable for application in chokes, WLAN networks, RF circuit matching and mobile communication equipment resonance.
€ 10,00
€ 0,05 Μονάδας (Σε ένα πακέτο των 200) (Exc. Vat)Χωρίς Φ.Π.Α
€ 12,40
€ 0,062 Μονάδας (Σε ένα πακέτο των 200) Με Φ.Π.Α
Standard
200
€ 10,00
€ 0,05 Μονάδας (Σε ένα πακέτο των 200) (Exc. Vat)Χωρίς Φ.Π.Α
€ 12,40
€ 0,062 Μονάδας (Σε ένα πακέτο των 200) Με Φ.Π.Α
Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
Standard
200
Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
MurataInductance
6.8 nH
Maximum dc Current
300mA
Package/Case
0402 (1005M)
Length
1mm
Depth
0.5mm
Height
0.5mm
Dimensions
1 x 0.5 x 0.5mm
Tolerance
±5%
Maximum DC Resistance
290mΩ
Series
LQG15HN
Inductor Construction
Multilayer
Maximum Operating Temperature
+125°C
Moulded
Yes
Minimum Operating Temperature
-55°C
Minimum Quality Factor
8
Χώρα Προέλευσης
Japan
Λεπτομέρειες Προϊόντος
Murata 0402 LQG15HN Series High Frequency Chip Inductors
LQG15HN SMD inductors from Murata feature a multilayer construction. Despite a lower Q factor than wire wound equivalents, the multilayer construction provides excellent balance between rated current, size and L value tolerance among others.
LQGH15HS SMD inductors are highly reliable and suitable for application in chokes, WLAN networks, RF circuit matching and mobile communication equipment resonance.


