Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
OhmiteFor Use With
TBH25, TCH35, TEH100, TEH70
Length
41.6mm
Width
25mm
Height
63.5mm
Dimensions
41.6 x 25 x 63.5mm
Thermal Resistance
3°C/W
Mounting
Vertical
Series
F
Colour
Black
Package Type
TO-218, TO-220, TO-247
Material
Aluminium
Surface Area
22814mm²
Special Features
With Solderable Pin
Finish
Black Anodized
Χώρα Προέλευσης
China
Λεπτομέρειες Προϊόντος
Ohmite F/R Series Vertical Mount Heatsinks
Ohmite F/R Series heatsink provides a large surface area with spring clipping mechanism to attach to a TO-220, TO-247, or TO-264 package. The self-aligning features of the clip assure secure attachment and enhanced thermal performance. Because no screws are required for device mounting, additional fins can be added to the rear side of the heatsink for increased total surface area in a more compact space.
€ 41,00
€ 4,10 Μονάδας (Σε ένα πακέτο των 10) (Exc. Vat)Χωρίς Φ.Π.Α
€ 50,84
€ 5,084 Μονάδας (Σε ένα πακέτο των 10) Με Φ.Π.Α
10
€ 41,00
€ 4,10 Μονάδας (Σε ένα πακέτο των 10) (Exc. Vat)Χωρίς Φ.Π.Α
€ 50,84
€ 5,084 Μονάδας (Σε ένα πακέτο των 10) Με Φ.Π.Α
10
Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
Παρακαλούμε ελέγξτε ξανά αργότερα.
Quantity Ποσότητα | Τιμή μονάδας | Per Πακέτο |
---|---|---|
10 - 90 | € 4,10 | € 41,00 |
100 - 240 | € 3,84 | € 38,40 |
250 - 490 | € 3,71 | € 37,10 |
500 - 990 | € 3,65 | € 36,50 |
1000+ | € 3,39 | € 33,90 |
Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
OhmiteFor Use With
TBH25, TCH35, TEH100, TEH70
Length
41.6mm
Width
25mm
Height
63.5mm
Dimensions
41.6 x 25 x 63.5mm
Thermal Resistance
3°C/W
Mounting
Vertical
Series
F
Colour
Black
Package Type
TO-218, TO-220, TO-247
Material
Aluminium
Surface Area
22814mm²
Special Features
With Solderable Pin
Finish
Black Anodized
Χώρα Προέλευσης
China
Λεπτομέρειες Προϊόντος
Ohmite F/R Series Vertical Mount Heatsinks
Ohmite F/R Series heatsink provides a large surface area with spring clipping mechanism to attach to a TO-220, TO-247, or TO-264 package. The self-aligning features of the clip assure secure attachment and enhanced thermal performance. Because no screws are required for device mounting, additional fins can be added to the rear side of the heatsink for increased total surface area in a more compact space.