Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
onsemiTransistor Type
NPN
Maximum DC Collector Current
5 A
Package Type
TO-220F
Mounting Type
Through Hole
Maximum Power Dissipation
40 W
Minimum DC Current Gain
20
Pin Count
3
Maximum Operating Temperature
+125 °C
Dimensions
10.36 x 4.9 x 16.07mm
Λεπτομέρειες Προϊόντος
ESBC™ Power Transistor, Fairchild Semiconductor
Bipolar NPN power transistors designed for use in ESBC™ (Emitter-Switched Bipolar/MOSFET Cascode) configurations together with appropriate power MOSFET devices. This power switch configuration provides increased efficiency, flexibility and robustness and driving power is minimized due to the absence of Miller capacitance in the design.
Bipolar Transistors, Fairchild Semiconductor
Bipolar Junction Transistors (BJT) broad range provides complete solutions for various circuit application needs. Innovative packages are designed for minimal size, highest reliability and maximum thermal performance.
P.O.A.
Μονάδας (Σε ένα πακέτο των 10) (Exc. Vat)Χωρίς Φ.Π.Α
Standard
10
P.O.A.
Μονάδας (Σε ένα πακέτο των 10) (Exc. Vat)Χωρίς Φ.Π.Α
Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
Standard
10
Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
onsemiTransistor Type
NPN
Maximum DC Collector Current
5 A
Package Type
TO-220F
Mounting Type
Through Hole
Maximum Power Dissipation
40 W
Minimum DC Current Gain
20
Pin Count
3
Maximum Operating Temperature
+125 °C
Dimensions
10.36 x 4.9 x 16.07mm
Λεπτομέρειες Προϊόντος
ESBC™ Power Transistor, Fairchild Semiconductor
Bipolar NPN power transistors designed for use in ESBC™ (Emitter-Switched Bipolar/MOSFET Cascode) configurations together with appropriate power MOSFET devices. This power switch configuration provides increased efficiency, flexibility and robustness and driving power is minimized due to the absence of Miller capacitance in the design.
Bipolar Transistors, Fairchild Semiconductor
Bipolar Junction Transistors (BJT) broad range provides complete solutions for various circuit application needs. Innovative packages are designed for minimal size, highest reliability and maximum thermal performance.


