Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
PanasonicSensor Type
Infrared Array Sensor
Maximum Output Current
10mA
Maximum Output Voltage
0.3 V
Package Type
Compact SMD Package
Pin Count
14
Series
Grid-EYE
Minimum Operating Supply Voltage
5 V
Maximum Operating Supply Voltage
5 V
Χώρα Προέλευσης
Japan
Λεπτομέρειες Προϊόντος
The Panasonic Infrared array sensor has digital readout of temperature data over I2C interface for simple integration. This sensor has 3.3 V operating voltage with new evaluation platforms with collocated Grid eye and camera to design machine learning based detection models. This sensor offers temperature detection of two dimensional area of vertical 8 x horizontal 8 matrix that is 64 pixels. Panasonic Grid-EYE is Infra-Red sensor comprised of 64 individual Thermopile elements arranged in an 8x8 matrix. The sensor comes in a compact surface mount package and can be very easily integrated into IoT applications.
Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
€ 72,93
€ 72,93 Μονάδας (Exc. Vat)Χωρίς Φ.Π.Α
€ 90,43
€ 90,43 Μονάδας Με Φ.Π.Α
Standard
1
€ 72,93
€ 72,93 Μονάδας (Exc. Vat)Χωρίς Φ.Π.Α
€ 90,43
€ 90,43 Μονάδας Με Φ.Π.Α
Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
Standard
1
Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
PanasonicSensor Type
Infrared Array Sensor
Maximum Output Current
10mA
Maximum Output Voltage
0.3 V
Package Type
Compact SMD Package
Pin Count
14
Series
Grid-EYE
Minimum Operating Supply Voltage
5 V
Maximum Operating Supply Voltage
5 V
Χώρα Προέλευσης
Japan
Λεπτομέρειες Προϊόντος
The Panasonic Infrared array sensor has digital readout of temperature data over I2C interface for simple integration. This sensor has 3.3 V operating voltage with new evaluation platforms with collocated Grid eye and camera to design machine learning based detection models. This sensor offers temperature detection of two dimensional area of vertical 8 x horizontal 8 matrix that is 64 pixels. Panasonic Grid-EYE is Infra-Red sensor comprised of 64 individual Thermopile elements arranged in an 8x8 matrix. The sensor comes in a compact surface mount package and can be very easily integrated into IoT applications.