RS PRO Paste 100 g
Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
RS ProApplication
Semiconductor, Copper
Package Size
100 g
Food Processing Safe
No
Cure Time
7 Days
Product Form
Paste
Χώρα Προέλευσης
Belgium
Λεπτομέρειες Προϊόντος
Non-Corrosive Silicone Sealant
One-component, room temperature curing silicone elastomer. Cross linking takes place in the presence of moisture in the air to form a flexible resilient silicone rubber. The material does not evolve any corrosive volatiles, e.g. acetic acid, amines, during cure and is therefore suitable for use on copper, its alloys and other sensitive metals. This property also results in a very low odour emission compared to acetoxy grades. The thixotropic paste has excellent adhesion to most materials (except PTFE and polyethylene) and can withstand temperatures of -40°C to +150°C whilst still maintaining chemical resistance. Typical uses are protection of semiconductor junctions, finishing protection of assemblies and delicate devices, sealing to copper clad items.
Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
€ 19,26
€ 19,26 Μονάδας (Exc. Vat)Χωρίς Φ.Π.Α
€ 23,88
€ 23,88 Μονάδας Με Φ.Π.Α
1
€ 19,26
€ 19,26 Μονάδας (Exc. Vat)Χωρίς Φ.Π.Α
€ 23,88
€ 23,88 Μονάδας Με Φ.Π.Α
Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
1
| Quantity Ποσότητα | Τιμή μονάδας |
|---|---|
| 1 - 5 | € 19,26 |
| 6 - 14 | € 18,72 |
| 15+ | € 18,69 |
Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
RS ProApplication
Semiconductor, Copper
Package Size
100 g
Food Processing Safe
No
Cure Time
7 Days
Product Form
Paste
Χώρα Προέλευσης
Belgium
Λεπτομέρειες Προϊόντος
Non-Corrosive Silicone Sealant
One-component, room temperature curing silicone elastomer. Cross linking takes place in the presence of moisture in the air to form a flexible resilient silicone rubber. The material does not evolve any corrosive volatiles, e.g. acetic acid, amines, during cure and is therefore suitable for use on copper, its alloys and other sensitive metals. This property also results in a very low odour emission compared to acetoxy grades. The thixotropic paste has excellent adhesion to most materials (except PTFE and polyethylene) and can withstand temperatures of -40°C to +150°C whilst still maintaining chemical resistance. Typical uses are protection of semiconductor junctions, finishing protection of assemblies and delicate devices, sealing to copper clad items.