Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
SamtecNumber of Contacts
160
Product Type
PCB Socket
Sub Type
Terminal Assembly
Number of Rows
2
Current
2.7A
Pitch
0.5mm
Termination Type
Solder
Housing Material
Liquid Crystal Polymer
Mount Type
Surface
Orientation
Straight
Stacking Height
10mm
Connector System
Board-to-Board
Voltage
339V
Series
ASP
Row Pitch
6.18mm
Minimum Operating Temperature
-55°C
Maximum Operating Temperature
125°C
Contact Material
Bronze
Contact Plating
Gold over Nickel
Contact Gender
Male
Standards/Approvals
RoHS
Χώρα Προέλευσης
Costa Rica
Λεπτομέρειες Προϊόντος
Altera® HSMC defines electrical and mechanical properties of a high speed mezzanine card interface. This specification standardizes the way in which mezzanine cards communicate and connect to host boards. By taking advantage of the high-performance I/O features found in todays FPGA devices, manufacturers can build a single mezzanine card that will then interface to multiple host boards. Similarly, they can build a host board that can leverage many different, pre-built, mezzanine cards.
Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
€ 642,60
€ 15,30 Each (In a Tray of 42) (Exc. Vat)Χωρίς Φ.Π.Α
€ 796,82
€ 18,972 Each (In a Tray of 42) Με Φ.Π.Α
42
€ 642,60
€ 15,30 Each (In a Tray of 42) (Exc. Vat)Χωρίς Φ.Π.Α
€ 796,82
€ 18,972 Each (In a Tray of 42) Με Φ.Π.Α
Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
42
Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
SamtecNumber of Contacts
160
Product Type
PCB Socket
Sub Type
Terminal Assembly
Number of Rows
2
Current
2.7A
Pitch
0.5mm
Termination Type
Solder
Housing Material
Liquid Crystal Polymer
Mount Type
Surface
Orientation
Straight
Stacking Height
10mm
Connector System
Board-to-Board
Voltage
339V
Series
ASP
Row Pitch
6.18mm
Minimum Operating Temperature
-55°C
Maximum Operating Temperature
125°C
Contact Material
Bronze
Contact Plating
Gold over Nickel
Contact Gender
Male
Standards/Approvals
RoHS
Χώρα Προέλευσης
Costa Rica
Λεπτομέρειες Προϊόντος
Altera® HSMC defines electrical and mechanical properties of a high speed mezzanine card interface. This specification standardizes the way in which mezzanine cards communicate and connect to host boards. By taking advantage of the high-performance I/O features found in todays FPGA devices, manufacturers can build a single mezzanine card that will then interface to multiple host boards. Similarly, they can build a host board that can leverage many different, pre-built, mezzanine cards.