
Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
SamtecNumber of Contacts
240
Product Type
PCB Socket
Number of Rows
8
Sub Type
Board-to-Board
Pitch
1.27mm
Current
1.8A
Termination Type
Solder
Housing Material
Liquid Crystal Polymer
Mount Type
Surface
Orientation
Straight
Stacking Height
7mm
Connector System
Board-to-Board
Voltage
240V
Series
SEAF
Minimum Operating Temperature
-55°C
Row Pitch
2.5mm
Contact Gender
Female
Maximum Operating Temperature
125°C
Contact Material
Copper
Contact Plating
Gold
Standards/Approvals
No
Λεπτομέρειες Προϊόντος
This open pin field array socket features a 1.27 mm x 1.27 mm pitch grid with up to 500 total I/Os. The rugged Edge Rate® contact system is signal integrity optimized with solder charged terminations for ease of processing. SEAF is a 28+ Gbps performance interconnect with low insertion/extraction forces and stack heights from 7 mm to 17.5 mm.
Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
P.O.A.
Μονάδας (Σε ένα καρούλι των 200) (Exc. Vat)Χωρίς Φ.Π.Α
200
P.O.A.
Μονάδας (Σε ένα καρούλι των 200) (Exc. Vat)Χωρίς Φ.Π.Α
Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
200
Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
SamtecNumber of Contacts
240
Product Type
PCB Socket
Number of Rows
8
Sub Type
Board-to-Board
Pitch
1.27mm
Current
1.8A
Termination Type
Solder
Housing Material
Liquid Crystal Polymer
Mount Type
Surface
Orientation
Straight
Stacking Height
7mm
Connector System
Board-to-Board
Voltage
240V
Series
SEAF
Minimum Operating Temperature
-55°C
Row Pitch
2.5mm
Contact Gender
Female
Maximum Operating Temperature
125°C
Contact Material
Copper
Contact Plating
Gold
Standards/Approvals
No
Λεπτομέρειες Προϊόντος
This open pin field array socket features a 1.27 mm x 1.27 mm pitch grid with up to 500 total I/Os. The rugged Edge Rate® contact system is signal integrity optimized with solder charged terminations for ease of processing. SEAF is a 28+ Gbps performance interconnect with low insertion/extraction forces and stack heights from 7 mm to 17.5 mm.