
Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
STMicroelectronicsProduct Type
MOSFET Modules
Maximum Continuous Drain Current Id
58A
Maximum Drain Source Voltage Vds
650V
Package Type
ACEPACK 2
Series
A2F20M65W3-FC
Mount Type
Screw
Pin Count
30
Number of Elements per Chip
4
Χώρα Προέλευσης
China
Λεπτομέρειες Προϊόντος
The STMicroelectronics power module realizes a four pack topology in an ACEPACK 2 module with NTC and capacitance, integrating the latest advances in silicon carbide MOSFETs from STMicroelectronics, represented by third generation technology. This modular solution is used to realize complex topologies with very high power density and efficiency requirements.
Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
P.O.A.
Each (In a Tray of 18) (Exc. Vat)Χωρίς Φ.Π.Α
18
P.O.A.
Each (In a Tray of 18) (Exc. Vat)Χωρίς Φ.Π.Α
Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
18
Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
STMicroelectronicsProduct Type
MOSFET Modules
Maximum Continuous Drain Current Id
58A
Maximum Drain Source Voltage Vds
650V
Package Type
ACEPACK 2
Series
A2F20M65W3-FC
Mount Type
Screw
Pin Count
30
Number of Elements per Chip
4
Χώρα Προέλευσης
China
Λεπτομέρειες Προϊόντος
The STMicroelectronics power module realizes a four pack topology in an ACEPACK 2 module with NTC and capacitance, integrating the latest advances in silicon carbide MOSFETs from STMicroelectronics, represented by third generation technology. This modular solution is used to realize complex topologies with very high power density and efficiency requirements.