Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
STMicroelectronicsTransistor Type
NPN
Maximum Continuous Collector Current
15 A
Maximum Collector Emitter Voltage
400 V
Maximum Emitter Base Voltage
5 V
Package Type
TO-247
Mounting Type
Through Hole
Pin Count
3
Transistor Configuration
Single
Number of Elements per Chip
1
Minimum DC Current Gain
300
Maximum Base Emitter Saturation Voltage
2.5 V
Maximum Collector Emitter Saturation Voltage
1.8 V
Maximum Operating Temperature
+175 °C
Width
5.15mm
Height
20.15mm
Minimum Operating Temperature
-65 °C
Length
15.75mm
Dimensions
15.75 x 5.15 x 20.15mm
Λεπτομέρειες Προϊόντος
NPN Darlington Transistors, STMicroelectronics
Bipolar Transistors, STMicroelectronics
A broad range of NPN and PNP Bipolar Transistors from STMicroelectronics including General Purpose, Darlington, Power and High-Voltage devices in both SMT and Through-hole packages.
Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
€ 127,50
€ 4,25 Μονάδας (Σε μία ράγα των 30) (Exc. Vat)Χωρίς Φ.Π.Α
€ 158,10
€ 5,27 Μονάδας (Σε μία ράγα των 30) Με Φ.Π.Α
30
€ 127,50
€ 4,25 Μονάδας (Σε μία ράγα των 30) (Exc. Vat)Χωρίς Φ.Π.Α
€ 158,10
€ 5,27 Μονάδας (Σε μία ράγα των 30) Με Φ.Π.Α
Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
30
Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
STMicroelectronicsTransistor Type
NPN
Maximum Continuous Collector Current
15 A
Maximum Collector Emitter Voltage
400 V
Maximum Emitter Base Voltage
5 V
Package Type
TO-247
Mounting Type
Through Hole
Pin Count
3
Transistor Configuration
Single
Number of Elements per Chip
1
Minimum DC Current Gain
300
Maximum Base Emitter Saturation Voltage
2.5 V
Maximum Collector Emitter Saturation Voltage
1.8 V
Maximum Operating Temperature
+175 °C
Width
5.15mm
Height
20.15mm
Minimum Operating Temperature
-65 °C
Length
15.75mm
Dimensions
15.75 x 5.15 x 20.15mm
Λεπτομέρειες Προϊόντος
NPN Darlington Transistors, STMicroelectronics
Bipolar Transistors, STMicroelectronics
A broad range of NPN and PNP Bipolar Transistors from STMicroelectronics including General Purpose, Darlington, Power and High-Voltage devices in both SMT and Through-hole packages.


