
Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
STMicroelectronicsProduct Type
Signal Filter
Series
MLPF
Packaging
Tape and Reel
Mount Type
Surface
Operating Frequency
479MHz
Termination Style
Surface Mount
Package/Case
CSPG
Minimum Operating Temperature
-40°C
Maximum Operating Temperature
105°C
Length
1.92mm
Height
0.68mm
Depth
1.52mm
Χώρα Προέλευσης
France
Λεπτομέρειες Προϊόντος
The STMicroelectronics RF matched filter high power two layer PCB integrates an impedance matching network along with a harmonics filter to enhance overall system efficiency. The impedance matching network has been carefully designed to maximize RF performance, ensuring reliable operation across demanding applications. This solution makes use of STMicroelectronics IPD technology on a non conductive glass substrate, which further optimizes RF characteristics and delivers improved robustness and efficiency.
Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
€ 2.100,00
€ 0,42 Μονάδας (Σε ένα καρούλι των 5000) (Exc. Vat)Χωρίς Φ.Π.Α
€ 2.604,00
€ 0,521 Μονάδας (Σε ένα καρούλι των 5000) Με Φ.Π.Α
5000
€ 2.100,00
€ 0,42 Μονάδας (Σε ένα καρούλι των 5000) (Exc. Vat)Χωρίς Φ.Π.Α
€ 2.604,00
€ 0,521 Μονάδας (Σε ένα καρούλι των 5000) Με Φ.Π.Α
Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
5000
Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
STMicroelectronicsProduct Type
Signal Filter
Series
MLPF
Packaging
Tape and Reel
Mount Type
Surface
Operating Frequency
479MHz
Termination Style
Surface Mount
Package/Case
CSPG
Minimum Operating Temperature
-40°C
Maximum Operating Temperature
105°C
Length
1.92mm
Height
0.68mm
Depth
1.52mm
Χώρα Προέλευσης
France
Λεπτομέρειες Προϊόντος
The STMicroelectronics RF matched filter high power two layer PCB integrates an impedance matching network along with a harmonics filter to enhance overall system efficiency. The impedance matching network has been carefully designed to maximize RF performance, ensuring reliable operation across demanding applications. This solution makes use of STMicroelectronics IPD technology on a non conductive glass substrate, which further optimizes RF characteristics and delivers improved robustness and efficiency.