TE Connectivity Vibration Sensor, 0°C → +70°C
Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
TE ConnectivityLength
41mm
Width
16mm
Depth
0.04mm
Minimum Operating Temperature
0°C
Maximum Operating Temperature
+70°C
Dimensions
41 (mm) x 16 (mm) x 40 (μm)
Χώρα Προέλευσης
China
Λεπτομέρειες Προϊόντος
TE Connectivity DT Series Piezoelectric Vibration Sensors
TE Connectivity’s MEAS piezoelectric film sensors are constructed from silver ink screen printed electrodes on rectangular piezo film. Piezo vibration sensors without a lead can be adhered directly to a surface using epoxy resin or double sided tape, and leads can be attached with crimps, eyelets, conductive epoxy or compressive clamping. For the piezoelectric sensors that come with a lead, 28 AWG wire and a riveted lug are used.
Suitable applications include recording the time of an event, sensing dynamic strain, counting the number of impacts, measuring impact related events and making sensor elements.
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€ 15,43
Μονάδας (Σε ένα Κουτί των 100) (Exc. Vat)Χωρίς Φ.Π.Α
€ 19,133
Μονάδας (Σε ένα Κουτί των 100) (Including VAT) Με Φ.Π.Α
100
€ 15,43
Μονάδας (Σε ένα Κουτί των 100) (Exc. Vat)Χωρίς Φ.Π.Α
€ 19,133
Μονάδας (Σε ένα Κουτί των 100) (Including VAT) Με Φ.Π.Α
100
Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
TE ConnectivityLength
41mm
Width
16mm
Depth
0.04mm
Minimum Operating Temperature
0°C
Maximum Operating Temperature
+70°C
Dimensions
41 (mm) x 16 (mm) x 40 (μm)
Χώρα Προέλευσης
China
Λεπτομέρειες Προϊόντος
TE Connectivity DT Series Piezoelectric Vibration Sensors
TE Connectivity’s MEAS piezoelectric film sensors are constructed from silver ink screen printed electrodes on rectangular piezo film. Piezo vibration sensors without a lead can be adhered directly to a surface using epoxy resin or double sided tape, and leads can be attached with crimps, eyelets, conductive epoxy or compressive clamping. For the piezoelectric sensors that come with a lead, 28 AWG wire and a riveted lug are used.
Suitable applications include recording the time of an event, sensing dynamic strain, counting the number of impacts, measuring impact related events and making sensor elements.