TE Connectivity, Z-PACK HM 2 mm Pitch Hard Metric Type A Backplane Connector, Right Angle Male, 4 Column, 1 Row, 4 Way
Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
TE ConnectivityBackplane Connector Type
Hard Metric Type A
Product Type
Backplane Connector
Number of Contacts
4
Current
16A
Orientation
Right Angle
Number of Columns
4
Voltage
250 V
Number of Rows
1
Connector Gender
Male
Housing Material
Glass Filled Polyester
Pitch
2mm
Contact Material
Copper Alloy
Mount Type
Through Hole
Contact Plating
Gold
Minimum Operating Temperature
-55°C
Termination Type
Press Fit
Contact Gender
Male
Maximum Operating Temperature
125°C
Standards/Approvals
No
Series
Z-PACK HM
Χώρα Προέλευσης
United States
Λεπτομέρειες Προϊόντος
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.
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Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
€ 18,85
€ 18,85 Μονάδας (Exc. Vat)Χωρίς Φ.Π.Α
€ 23,37
€ 23,37 Μονάδας Με Φ.Π.Α
Standard
1
€ 18,85
€ 18,85 Μονάδας (Exc. Vat)Χωρίς Φ.Π.Α
€ 23,37
€ 23,37 Μονάδας Με Φ.Π.Α
Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
Standard
1
| Quantity Ποσότητα | Τιμή μονάδας |
|---|---|
| 1 - 19 | € 18,85 |
| 20 - 74 | € 18,17 |
| 75 - 299 | € 17,52 |
| 300 - 599 | € 17,10 |
| 600+ | € 16,91 |
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products
Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
TE ConnectivityBackplane Connector Type
Hard Metric Type A
Product Type
Backplane Connector
Number of Contacts
4
Current
16A
Orientation
Right Angle
Number of Columns
4
Voltage
250 V
Number of Rows
1
Connector Gender
Male
Housing Material
Glass Filled Polyester
Pitch
2mm
Contact Material
Copper Alloy
Mount Type
Through Hole
Contact Plating
Gold
Minimum Operating Temperature
-55°C
Termination Type
Press Fit
Contact Gender
Male
Maximum Operating Temperature
125°C
Standards/Approvals
No
Series
Z-PACK HM
Χώρα Προέλευσης
United States
Λεπτομέρειες Προϊόντος
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products