TE Connectivity, Z-PACK HM 2mm Pitch Backplane Connector, Right Angle, 1 Row, 4 Way
Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
TE ConnectivityNumber Of Contacts
4
Number Of Rows
1
Body Orientation
Right Angle
Pitch
2mm
Contact Material
Copper Alloy
Mounting Type
Through Hole
Current Rating
16A
Termination Method
Press-Fit
Series
Z-PACK HM
Χώρα Προέλευσης
United States
Λεπτομέρειες Προϊόντος
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.
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€ 543,40
€ 14,30 Μονάδας (Σε μία ράγα των 38) (Exc. Vat)Χωρίς Φ.Π.Α
€ 673,82
€ 17,732 Μονάδας (Σε μία ράγα των 38) Με Φ.Π.Α
38
€ 543,40
€ 14,30 Μονάδας (Σε μία ράγα των 38) (Exc. Vat)Χωρίς Φ.Π.Α
€ 673,82
€ 17,732 Μονάδας (Σε μία ράγα των 38) Με Φ.Π.Α
Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
38
Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products
Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
TE ConnectivityNumber Of Contacts
4
Number Of Rows
1
Body Orientation
Right Angle
Pitch
2mm
Contact Material
Copper Alloy
Mounting Type
Through Hole
Current Rating
16A
Termination Method
Press-Fit
Series
Z-PACK HM
Χώρα Προέλευσης
United States
Λεπτομέρειες Προϊόντος
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products