TE Connectivity, Z-PACK HM-Zd 2.5mm Pitch 4 Pair, High Speed Hard Metric Backplane Connector, Male, Straight, 10
Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
TE ConnectivityBackplane Connector Type
4 Pair, High Speed Hard Metric
Gender
Male
Number Of Contacts
80
Number of Columns
10
Number Of Rows
8
Body Orientation
Straight
Housing Material
PET
Pitch
2.5mm
Contact Material
Phosphor Bronze
Contact Plating
Gold over Nickel
Termination Method
Press-In
Series
Z-PACK HM-Zd
Maximum Operating Temperature
+105°C
Minimum Operating Temperature
-65°C
Χώρα Προέλευσης
United States
Λεπτομέρειες Προϊόντος
TE Connectivity Z-PACK HM-Zd Plus 4 Pair Receptacle Connector
Z-PACK HM-Zd Plus 80 way 4 pair press-fit board to board receptacle connector for updating connection between daughter card and motherboard through the addition of added ground contacts on the outside pair of the receptacle connector system resulting in enhanced performance and lower cross talk. Integrated pre-alignment features and polarization are built into the mating interface for this Z-PACK HM-Zd Plus connector to ensure secure mating and data rates of up to 15 Gbp/s with a migration plan to 20 Gbp/s can be supported. This Z-PACK HM-Zd Plus 4 pair receptacle connector can also be plugged into existing Z-PACK HM-Zd backplane connectors enabling field speed upgrades, it is also suitable for use with Advanced TCA next-generation applications and specified for Advanced zone 2 requirements. The Z-PACK HM-Zd connector is through hole mounting has a standard module size of 25mm and a 25.40mm card pitch.
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P.O.A.
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1
Ideate. Create. Collaborate
JOIN FOR FREE
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- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
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- Download 3D Models, Schematics and Footprints from more than a million products
Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
TE ConnectivityBackplane Connector Type
4 Pair, High Speed Hard Metric
Gender
Male
Number Of Contacts
80
Number of Columns
10
Number Of Rows
8
Body Orientation
Straight
Housing Material
PET
Pitch
2.5mm
Contact Material
Phosphor Bronze
Contact Plating
Gold over Nickel
Termination Method
Press-In
Series
Z-PACK HM-Zd
Maximum Operating Temperature
+105°C
Minimum Operating Temperature
-65°C
Χώρα Προέλευσης
United States
Λεπτομέρειες Προϊόντος
TE Connectivity Z-PACK HM-Zd Plus 4 Pair Receptacle Connector
Z-PACK HM-Zd Plus 80 way 4 pair press-fit board to board receptacle connector for updating connection between daughter card and motherboard through the addition of added ground contacts on the outside pair of the receptacle connector system resulting in enhanced performance and lower cross talk. Integrated pre-alignment features and polarization are built into the mating interface for this Z-PACK HM-Zd Plus connector to ensure secure mating and data rates of up to 15 Gbp/s with a migration plan to 20 Gbp/s can be supported. This Z-PACK HM-Zd Plus 4 pair receptacle connector can also be plugged into existing Z-PACK HM-Zd backplane connectors enabling field speed upgrades, it is also suitable for use with Advanced TCA next-generation applications and specified for Advanced zone 2 requirements. The Z-PACK HM-Zd connector is through hole mounting has a standard module size of 25mm and a 25.40mm card pitch.
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products