TE Connectivity 2.54mm Pitch Vertical 28 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 3A

Κωδικός Προϊόντος της RS: 173-5555Κατασκευαστής: TE ConnectivityΚωδικός Κατασκευαστή: 1571552-9
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Τεχνικό φυλλάδιο

Προδιαγραφές

Number Of Contacts

28

Mounting Type

Through Hole

Pin Type

Stamped

Pitch

2.54mm

Row Width

15.24mm

Frame Type

Open Frame

Termination Method

Solder

Contact Plating

Tin

Current Rating

3A

Orientation

Vertical

Length

35.56mm

Width

4.57mm

Depth

17.78mm

Dimensions

35.56 x 4.57 x 17.78mm

Minimum Operating Temperature

-55°C

Maximum Operating Temperature

+105°C

Housing Material

PCT

Contact Material

Beryllium Copper

Χώρα Προέλευσης

Switzerland

Λεπτομέρειες Προϊόντος

800 Series Open Frame

A range of Series 800 Open Frame DIP Economy IC Sockets with Stamped Contacts.

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P.O.A.

TE Connectivity 2.54mm Pitch Vertical 28 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 3A

P.O.A.

TE Connectivity 2.54mm Pitch Vertical 28 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 3A
Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη

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Τεχνικό φυλλάδιο

Προδιαγραφές

Number Of Contacts

28

Mounting Type

Through Hole

Pin Type

Stamped

Pitch

2.54mm

Row Width

15.24mm

Frame Type

Open Frame

Termination Method

Solder

Contact Plating

Tin

Current Rating

3A

Orientation

Vertical

Length

35.56mm

Width

4.57mm

Depth

17.78mm

Dimensions

35.56 x 4.57 x 17.78mm

Minimum Operating Temperature

-55°C

Maximum Operating Temperature

+105°C

Housing Material

PCT

Contact Material

Beryllium Copper

Χώρα Προέλευσης

Switzerland

Λεπτομέρειες Προϊόντος

800 Series Open Frame

A range of Series 800 Open Frame DIP Economy IC Sockets with Stamped Contacts.