Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
TE ConnectivityNumber Of Contacts
16
Mounting Type
Through Hole
Pin Type
Standard
Pitch
2.54mm
Row Width
2.54mm
Frame Type
Closed Frame
Termination Method
Solder
Contact Plating
Gold
Orientation
Vertical
Length
20.32mm
Width
10.16mm
Depth
4.57mm
Dimensions
20.32 x 10.16 x 4.57mm
Housing Material
Thermoplastic
Contact Material
Beryllium Copper
Minimum Operating Temperature
-55°C
Maximum Operating Temperature
+105°C
Χώρα Προέλευσης
United States
Λεπτομέρειες Προϊόντος
TE Connectivity PCB DIP Sockets with Stamped and Formed Contacts - Augat 500 Series
PCB DIP sockets with stamped and formed contacts in a thermoplastic closed frame insulator. These PCB DIP sockets have a 2.54mm centerline with a 7.62 mm row spacing. The contacts of these PCB DIP IC sockets are gold plated with 4 fingered mating.
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Παρακαλούμε ελέγξτε ξανά αργότερα.
€ 1,97
Μονάδας (Σε μία ράγα των 30) (Exc. Vat)Χωρίς Φ.Π.Α
€ 2,443
Μονάδας (Σε μία ράγα των 30) (Including VAT) Με Φ.Π.Α
30
€ 1,97
Μονάδας (Σε μία ράγα των 30) (Exc. Vat)Χωρίς Φ.Π.Α
€ 2,443
Μονάδας (Σε μία ράγα των 30) (Including VAT) Με Φ.Π.Α
30
Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
TE ConnectivityNumber Of Contacts
16
Mounting Type
Through Hole
Pin Type
Standard
Pitch
2.54mm
Row Width
2.54mm
Frame Type
Closed Frame
Termination Method
Solder
Contact Plating
Gold
Orientation
Vertical
Length
20.32mm
Width
10.16mm
Depth
4.57mm
Dimensions
20.32 x 10.16 x 4.57mm
Housing Material
Thermoplastic
Contact Material
Beryllium Copper
Minimum Operating Temperature
-55°C
Maximum Operating Temperature
+105°C
Χώρα Προέλευσης
United States
Λεπτομέρειες Προϊόντος
TE Connectivity PCB DIP Sockets with Stamped and Formed Contacts - Augat 500 Series
PCB DIP sockets with stamped and formed contacts in a thermoplastic closed frame insulator. These PCB DIP sockets have a 2.54mm centerline with a 7.62 mm row spacing. The contacts of these PCB DIP IC sockets are gold plated with 4 fingered mating.