TE Connectivity Z-PACK HM Series Straight Through Hole PCB Socket, 3-Contact, 2.54 mm Pitch Solder
Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
TE ConnectivityNumber of Contacts
3
Product Type
PCB Socket
Sub Type
Board-to-Board
Pitch
2.54mm
Current
1.15A
Termination Type
Solder
Housing Material
Liquid Crystal Polymer
Mount Type
Through Hole
Orientation
Straight
Connector System
Board-to-Board
Voltage
250 V
Series
Z-PACK HM
Minimum Operating Temperature
-65°C
Contact Gender
Female
Maximum Operating Temperature
125°C
Contact Material
Copper
Contact Plating
Gold
Standards/Approvals
RoHS
Χώρα Προέλευσης
United States
Λεπτομέρειες Προϊόντος
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.
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Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
€ 6,47
€ 6,47 Μονάδας (Exc. Vat)Χωρίς Φ.Π.Α
€ 8,02
€ 8,02 Μονάδας Με Φ.Π.Α
Standard
1
€ 6,47
€ 6,47 Μονάδας (Exc. Vat)Χωρίς Φ.Π.Α
€ 8,02
€ 8,02 Μονάδας Με Φ.Π.Α
Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
Standard
1
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products
Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
TE ConnectivityNumber of Contacts
3
Product Type
PCB Socket
Sub Type
Board-to-Board
Pitch
2.54mm
Current
1.15A
Termination Type
Solder
Housing Material
Liquid Crystal Polymer
Mount Type
Through Hole
Orientation
Straight
Connector System
Board-to-Board
Voltage
250 V
Series
Z-PACK HM
Minimum Operating Temperature
-65°C
Contact Gender
Female
Maximum Operating Temperature
125°C
Contact Material
Copper
Contact Plating
Gold
Standards/Approvals
RoHS
Χώρα Προέλευσης
United States
Λεπτομέρειες Προϊόντος
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products