Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
TE ConnectivityProduct Type
Pin Header
Series
AMPMODU MOD II
Pitch
2.54mm
Current
3A
Number of Contacts
50
Housing Material
Polyester
Number of Rows
1
Orientation
Right Angle
Shrouded/Unshrouded
Unshrouded
Connector System
Board-to-Board, Wire-to-Board
Mount Type
Through Hole
Contact Material
Brass
Contact Plating
Gold
Minimum Operating Temperature
-55°C
Row Pitch
2.54mm
Termination Type
Solder
Contact Gender
Male
Tail Pin Length
3.2mm
Maximum Operating Temperature
105°C
Mating Pin Length
5.8mm
Standards/Approvals
No
Λεπτομέρειες Προϊόντος
Unshrouded Pin Headers
2.54mm TE Connectivity AMPMODU™ Range – Style 2 (European)
A wide range of modular interconnects on the industry standard 2.54mm (0.1in ) Grid, addressing applications across all industry sectors. Designed for wire to board or board to board connection, including stacking.
Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
€ 10,94
€ 10,94 Μονάδας (Exc. Vat)Χωρίς Φ.Π.Α
€ 13,57
€ 13,57 Μονάδας Με Φ.Π.Α
Standard
1
€ 10,94
€ 10,94 Μονάδας (Exc. Vat)Χωρίς Φ.Π.Α
€ 13,57
€ 13,57 Μονάδας Με Φ.Π.Α
Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
Standard
1
| Quantity Ποσότητα | Τιμή μονάδας |
|---|---|
| 1 - 19 | € 10,94 |
| 20 - 74 | € 10,57 |
| 75 - 299 | € 10,26 |
| 300 - 599 | € 7,94 |
| 600+ | € 7,88 |
Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
TE ConnectivityProduct Type
Pin Header
Series
AMPMODU MOD II
Pitch
2.54mm
Current
3A
Number of Contacts
50
Housing Material
Polyester
Number of Rows
1
Orientation
Right Angle
Shrouded/Unshrouded
Unshrouded
Connector System
Board-to-Board, Wire-to-Board
Mount Type
Through Hole
Contact Material
Brass
Contact Plating
Gold
Minimum Operating Temperature
-55°C
Row Pitch
2.54mm
Termination Type
Solder
Contact Gender
Male
Tail Pin Length
3.2mm
Maximum Operating Temperature
105°C
Mating Pin Length
5.8mm
Standards/Approvals
No
Λεπτομέρειες Προϊόντος
Unshrouded Pin Headers
2.54mm TE Connectivity AMPMODU™ Range – Style 2 (European)
A wide range of modular interconnects on the industry standard 2.54mm (0.1in ) Grid, addressing applications across all industry sectors. Designed for wire to board or board to board connection, including stacking.


