Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
TE ConnectivityProduct Type
Pin Header
Series
AMPMODU MOD II
Pitch
2.54mm
Current
3A
Number of Contacts
100
Housing Material
Polyester
Number of Rows
2
Orientation
Right Angle
Shrouded/Unshrouded
Unshrouded
Connector System
Board-to-Board, Wire-to-Board
Mount Type
Through Hole
Contact Material
Brass
Contact Plating
Gold
Minimum Operating Temperature
-55°C
Row Pitch
2.54mm
Termination Type
Solder
Contact Gender
Male
Tail Pin Length
3.2mm
Maximum Operating Temperature
105°C
Mating Pin Length
5.8mm
Standards/Approvals
No
Voltage
750V
Λεπτομέρειες Προϊόντος
Unshrouded Pin Headers
2.54mm TE Connectivity AMPMODU™ Range – Style 2 (European)
A wide range of modular interconnects on the industry standard 2.54mm (0.1in ) Grid, addressing applications across all industry sectors. Designed for wire to board or board to board connection, including stacking.
Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
€ 13,57
€ 13,57 Μονάδας (Exc. Vat)Χωρίς Φ.Π.Α
€ 16,83
€ 16,83 Μονάδας Με Φ.Π.Α
Standard
1
€ 13,57
€ 13,57 Μονάδας (Exc. Vat)Χωρίς Φ.Π.Α
€ 16,83
€ 16,83 Μονάδας Με Φ.Π.Α
Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
Standard
1
| Quantity Ποσότητα | Τιμή μονάδας |
|---|---|
| 1 - 9 | € 13,57 |
| 10 - 24 | € 12,82 |
| 25 - 99 | € 11,90 |
| 100+ | € 11,20 |
Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
TE ConnectivityProduct Type
Pin Header
Series
AMPMODU MOD II
Pitch
2.54mm
Current
3A
Number of Contacts
100
Housing Material
Polyester
Number of Rows
2
Orientation
Right Angle
Shrouded/Unshrouded
Unshrouded
Connector System
Board-to-Board, Wire-to-Board
Mount Type
Through Hole
Contact Material
Brass
Contact Plating
Gold
Minimum Operating Temperature
-55°C
Row Pitch
2.54mm
Termination Type
Solder
Contact Gender
Male
Tail Pin Length
3.2mm
Maximum Operating Temperature
105°C
Mating Pin Length
5.8mm
Standards/Approvals
No
Voltage
750V
Λεπτομέρειες Προϊόντος
Unshrouded Pin Headers
2.54mm TE Connectivity AMPMODU™ Range – Style 2 (European)
A wide range of modular interconnects on the industry standard 2.54mm (0.1in ) Grid, addressing applications across all industry sectors. Designed for wire to board or board to board connection, including stacking.


