TE Connectivity Backplane Connector Through Hole, 4, 250V 10A
Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
TE ConnectivityPole Format
4
Product Type
Backplane Connector
Current
10A
Voltage
250V
Connector Gender
Female
Mount Type
Through Hole
Contact Material
Phosphor Bronze
Housing Material
Polyethylene Terephthalate
Minimum Operating Temperature
-55°C
Contact Gender
Female
Maximum Operating Temperature
125°C
Contact Plating
Gold over Palladium Nickel over Nickel
Standards/Approvals
No
Χώρα Προέλευσης
United States
Λεπτομέρειες Προϊόντος
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.
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Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
€ 528,54
€ 11,49 Μονάδας (Σε μία ράγα των 46) (Exc. Vat)Χωρίς Φ.Π.Α
€ 655,39
€ 14,248 Μονάδας (Σε μία ράγα των 46) Με Φ.Π.Α
46
€ 528,54
€ 11,49 Μονάδας (Σε μία ράγα των 46) (Exc. Vat)Χωρίς Φ.Π.Α
€ 655,39
€ 14,248 Μονάδας (Σε μία ράγα των 46) Με Φ.Π.Α
Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
46
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products
Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
TE ConnectivityPole Format
4
Product Type
Backplane Connector
Current
10A
Voltage
250V
Connector Gender
Female
Mount Type
Through Hole
Contact Material
Phosphor Bronze
Housing Material
Polyethylene Terephthalate
Minimum Operating Temperature
-55°C
Contact Gender
Female
Maximum Operating Temperature
125°C
Contact Plating
Gold over Palladium Nickel over Nickel
Standards/Approvals
No
Χώρα Προέλευσης
United States
Λεπτομέρειες Προϊόντος
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products