TE Connectivity Backplane Connector Through Hole Socket, Press-In Termination

Κωδικός Προϊόντος της RS: 164-4187Κατασκευαστής: TE ConnectivityΚωδικός Κατασκευαστή: 5223995-1
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View all in Compact Power Connectors

Τεχνικό φυλλάδιο

Προδιαγραφές

Plug/Socket

Socket

Gender

Female

Mounting Type

Through Hole

Termination Method

Press-In

Contact Material

Phosphor Bronze

Housing Material

PET

Contact Plating

Gold over Palladium Nickel over Nickel

Χώρα Προέλευσης

United States

Λεπτομέρειες Προϊόντος

Z-PACK™ HS3 Connectors

The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.

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Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη

Παρακαλούμε ελέγξτε ξανά αργότερα.

Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη

€ 8,07

Μονάδας (Σε μία ράγα των 46) (Exc. Vat)Χωρίς Φ.Π.Α

€ 10,007

Μονάδας (Σε μία ράγα των 46) (Including VAT) Με Φ.Π.Α

TE Connectivity Backplane Connector Through Hole Socket, Press-In Termination

€ 8,07

Μονάδας (Σε μία ράγα των 46) (Exc. Vat)Χωρίς Φ.Π.Α

€ 10,007

Μονάδας (Σε μία ράγα των 46) (Including VAT) Με Φ.Π.Α

TE Connectivity Backplane Connector Through Hole Socket, Press-In Termination
Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more

Τεχνικό φυλλάδιο

Προδιαγραφές

Plug/Socket

Socket

Gender

Female

Mounting Type

Through Hole

Termination Method

Press-In

Contact Material

Phosphor Bronze

Housing Material

PET

Contact Plating

Gold over Palladium Nickel over Nickel

Χώρα Προέλευσης

United States

Λεπτομέρειες Προϊόντος

Z-PACK™ HS3 Connectors

The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more