Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
WinslowPitch
1.27 mm, 2.54 mm
End 1
84 Pin Female PLCC
End 2
84 Pin Male DIP
End 1 Number of Contacts
84
End 2 Number of Contacts
84
End 1 Type
PLCC
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Χώρα Προέλευσης
United Kingdom
Λεπτομέρειες Προϊόντος
PLCC to DIP Sockets
Adaptics of the same specification as the dual in line package to PLCC versions, which enable PLCCs to be converted to Dual in line package format of 0.1in. pitch and 0.6in. row spacing. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
Παρακαλούμε ελέγξτε ξανά αργότερα.
€ 37,86
Μονάδας (Exc. Vat)Χωρίς Φ.Π.Α
€ 46,95
Μονάδας Με Φ.Π.Α
1
€ 37,86
Μονάδας (Exc. Vat)Χωρίς Φ.Π.Α
€ 46,95
Μονάδας Με Φ.Π.Α
1
Αγοράστε μαζικά
Quantity Ποσότητα | Τιμή μονάδας |
---|---|
1 - 4 | € 37,86 |
5+ | € 36,27 |
Τεχνικό φυλλάδιο
Προδιαγραφές
Brand
WinslowPitch
1.27 mm, 2.54 mm
End 1
84 Pin Female PLCC
End 2
84 Pin Male DIP
End 1 Number of Contacts
84
End 2 Number of Contacts
84
End 1 Type
PLCC
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Χώρα Προέλευσης
United Kingdom
Λεπτομέρειες Προϊόντος
PLCC to DIP Sockets
Adaptics of the same specification as the dual in line package to PLCC versions, which enable PLCCs to be converted to Dual in line package format of 0.1in. pitch and 0.6in. row spacing. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.