Bergquist Self-Adhesive Thermal Interface Pad, 0.001in Thick, 1.5W/m·K, Hi-Flow 650P

Κωδικός Προϊόντος της RS: 752-4890Κατασκευαστής: BergquistΚωδικός Κατασκευαστή: HF650P-0.001-01-00-104
brand-logo

Τεχνικό φυλλάδιο

Προδιαγραφές

Thickness

0.001in

Thermal Conductivity

1.5W/m·K

Material

Hi-Flow 650P

Self-Adhesive

Yes

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

+150°C

Material Trade Name

Hi-Flow 650P

Operating Temperature Range

-40 → +150 °C

Χώρα Προέλευσης

United States

Λεπτομέρειες Προϊόντος

Hi-Flow 650P

Hi-Flow® 650P is a thermally conductive phase change material, reinforced with a polyimide film that is naturally tacky on one side. The polyimide film provides a high dielectric strength and high cut through resistance. Hi-Flow® 650P offers high temperature reliability ideal for automotive applications. Hi-Flow® 650P is designed for use between a high-power electrical device requiring electrical isolation from the heat sink and is ideal for automated dispensing systems. Typical applications include spring / clip-mounted devices and discrete power semiconductors and modules.

Μπορεί να σας ενδιαφέρει
Bergquist Self-Adhesive Thermal Interface Pad, 0.139mm Thick, 0.9W/m·K, Hi-Flow 105, 25.4 x 19mm
P.O.A.Μονάδας (Σε ένα πακέτο των 50) (Exc. Vat)Χωρίς Φ.Π.Α
Bergquist Self-Adhesive Thermal Interface Pad, 0.001in Thick, 1.5W/m·K, Hi-Flow 650P
€ 1,872Μονάδας (Σε μία Σακούλα των 50) (Exc. Vat)Χωρίς Φ.Π.Α

Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη

Παρακαλούμε ελέγξτε ξανά αργότερα.

Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη

P.O.A.

Bergquist Self-Adhesive Thermal Interface Pad, 0.001in Thick, 1.5W/m·K, Hi-Flow 650P

P.O.A.

Bergquist Self-Adhesive Thermal Interface Pad, 0.001in Thick, 1.5W/m·K, Hi-Flow 650P
Ημερομηνία αποθέματος προσωρινά μη διαθέσιμη
Μπορεί να σας ενδιαφέρει
Bergquist Self-Adhesive Thermal Interface Pad, 0.139mm Thick, 0.9W/m·K, Hi-Flow 105, 25.4 x 19mm
P.O.A.Μονάδας (Σε ένα πακέτο των 50) (Exc. Vat)Χωρίς Φ.Π.Α
Bergquist Self-Adhesive Thermal Interface Pad, 0.001in Thick, 1.5W/m·K, Hi-Flow 650P
€ 1,872Μονάδας (Σε μία Σακούλα των 50) (Exc. Vat)Χωρίς Φ.Π.Α

Τεχνικό φυλλάδιο

Προδιαγραφές

Thickness

0.001in

Thermal Conductivity

1.5W/m·K

Material

Hi-Flow 650P

Self-Adhesive

Yes

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

+150°C

Material Trade Name

Hi-Flow 650P

Operating Temperature Range

-40 → +150 °C

Χώρα Προέλευσης

United States

Λεπτομέρειες Προϊόντος

Hi-Flow 650P

Hi-Flow® 650P is a thermally conductive phase change material, reinforced with a polyimide film that is naturally tacky on one side. The polyimide film provides a high dielectric strength and high cut through resistance. Hi-Flow® 650P offers high temperature reliability ideal for automotive applications. Hi-Flow® 650P is designed for use between a high-power electrical device requiring electrical isolation from the heat sink and is ideal for automated dispensing systems. Typical applications include spring / clip-mounted devices and discrete power semiconductors and modules.

Μπορεί να σας ενδιαφέρει
Bergquist Self-Adhesive Thermal Interface Pad, 0.139mm Thick, 0.9W/m·K, Hi-Flow 105, 25.4 x 19mm
P.O.A.Μονάδας (Σε ένα πακέτο των 50) (Exc. Vat)Χωρίς Φ.Π.Α
Bergquist Self-Adhesive Thermal Interface Pad, 0.001in Thick, 1.5W/m·K, Hi-Flow 650P
€ 1,872Μονάδας (Σε μία Σακούλα των 50) (Exc. Vat)Χωρίς Φ.Π.Α